12results about "Investigating semiconductor impurities" patented technology

The application discloses a kind of detection semiconductor light-emitting chip's polarized microscopy system and method, system includes chip excitation module, incident illumination modulation module, microscopic adjustment module, exit imaging module and control and image processing module.The application is continuously polarized by control module to incident illumination modulation module Modulation, modulated incident light is acted on light-emitting chip exit end face by microscopic system module, simultaneously using control module to adjust exit imaging module and carry out real-time image collection, obtain the polarized parameter image of exit end face by image processing module;Close incident illumination module, after using chip excitation module to excite light-emitting chip, adjust three-dimensional platform and exit imaging module by control module, real-time image collection, finally obtain the polarized parameter diagram of near-field light spot by image processing module.The application has very strong characterization ability and high sensitivity to the end face structure and near-field light spot of semiconductor light-emitting chip.

The application discloses a cleaning method for removing a suction pen mark on a surface of a silicon carbide substrate and the silicon carbide substrate, and belongs to the technical field of silicon carbide detection. The cleaning method comprises the following steps: (1) using a mixed solution of ammonia and hydrogen peroxide to clean the surface of the substrate, so as to pre-oxidize the surface of the substrate; (2) using ozone water to clean the pre-oxidized substrate, so as to obtain a substrate containing an oxidation layer; and (3) using an acidic cleaning solution with a pH value of 2.0-3.5 to clean the substrate containing the oxidation layer, and then performing water washing and blowing dry, so as to obtain a cleaned silicon carbide substrate. The method can change the Zeta potential of the oxidation layer on the surface of the substrate, so that the surface potential of the substrate is not lower than 0 mV, thereby reducing the adsorption of positively charged particles on the suction pen, achieving the technical effect of completely removing the suction pen mark, and improving the quality of the silicon carbide substrate.

The application discloses a microscopic imaging method, which comprises the following steps: selecting a beam combination imaging device with at least two objectives, aiming the objectives at a to-be-measured object, and installing a camera at a camera interface of the beam combination imaging device; adjusting all the objectives so that there is a height difference in the depth of field intervals of all the objectives; and obtaining images of target regions corresponding to all the objectives by the camera. The application further discloses a microscopic imaging device and a storage medium. By using the beam combination imaging device with the single-camera multi-objective structure, the depth of field intervals of the camera can be increased by focusing different objectives on different height planes.

The present invention relates to an apparatus and method for enabling the inspection of a substantially transparent substrate. The apparatus comprises a housing and a light source, and the method enables the effective analysis of a substantially transparent substrate placed within the housing.

The invention relates to a device and a method capable of inspecting a substantially transparent substrate. The apparatus comprises a housing and a light source, and the method enables analysis of a substantially transparent substrate located within the housing in an efficient manner.

Provided is a method for blending of agricultural product utilizing hyperspectral imaging. At least one region along a sample of agricultural product is scanned using at least one light source of different wavelengths. Hyperspectral images are generated from the at least one region. A spectral fingerprint for the sample of agricultural product is formed from the hyperspectral images. A plurality of samples of agricultural product is blended based on the spectral fingerprints of the samples according to parameters determined by executing a blending algorithm.

The invention discloses a wafer surface trace particulate matter recognition method and system based on multispectral imaging, and relates to the technical field of wafer defect detection and measurement in the semiconductor manufacturing process. Selective attenuation is carried out on diffraction peak components corresponding to the periodic structure, spatial domain characterization is reconstructed through inverse transformation, and the masking effect of a fixed mode background on particle detectability is reduced from the source; meanwhile, the frequency domain background suppression model is subjected to supervision or self-supervision training by utilizing a defect-free reference wafer frequency spectrum and a layout simulation diffraction frequency spectrum, so that the model learns a stable structure and an allowable fluctuation range of a background component, and the robustness and consistency under the conditions of graph drift and micro deformation are improved.

An inspection system may perform an inspection recipe by receiving reference SHG images of a reference structure based on a scan of the reference structure with an illumination beam and collecting second harmonic generation (SHG) light in response to the illumination beam, where the reference structure includes a multilayer structure including one or more inversion-symmetric materials. The system may further receive test SHG images of a test structure based on a scan of the test structure by illuminating the test structure with the illumination beam and collecting the SHG light in response to the illumination beam, where the test structure and the reference structure have a common design. The system may further identify defects in the test structure by comparing the test and reference SHG images.

The invention relates to a device and a method for enabling inspection of a substantially transparent substrate. The device comprises thereto a housing and a light source, and method enables analyzing of a substantially transparent substrate positioned within the housing in an effective manner.

Techniques for inspecting a substrate can include scanning the substrate across a plurality of scan positions using an interrogation beam having a width substantially equal to or greater than a diameter of at least one surface feature on a surface of the substrate to generate scanning results. A set of raw centroid calculation results can be generated based on the scanning results. An error property can be determined and removed from the raw centroid calculation results to generated refined centroid calculation results. A characteristic of the surface feature can be determined based on the centroid calculation results.

There is provided a system and method of examining a specimen. The method comprises obtaining an actual measurement in response to scanning the specimen using a set of scanning parameters with predefined values; obtaining a simulated measurement based on design data; comparing the actual measurement with the simulated measurement to identify a deviation with respect to a predefined tolerance; identifying at least one structural property as root cause of the deviation by: obtaining one or more additional actual measurements in response to scanning the specimen using one or more varying values of at least one scanning parameter; and providing the actual measurement and the additional actual measurements to a simulation model representative of simulated measurement distribution in a multi-dimensional property space characterized by the structural properties of the plurality of layers and the at least one scanning parameter, thereby identifying the at least one structural property.

Techniques for inspecting a substrate can include scanning the substrate across a plurality of scan positions using an interrogation beam having a width substantially equal to or greater than a diameter of at least one surface feature on a surface of the substrate to generate scanning results. A set of raw centroid calculation results can be generated based on the scanning results. An error property can be determined and removed from the raw centroid calculation results to generated refined centroid calculation results. A characteristic of the surface feature can be determined based on the centroid calculation results.