Overlay metrology using multiple parameter configurations

A metering system and superimposed signal technology, applied in the direction of using optical devices, using refraction elements to generate spectra, using diffraction elements to generate spectra, etc., can solve the problem of accuracy repeatability changes, accuracy repeatability sensitivity, and influence on superposition performance, etc. question

Active Publication Date: 2020-05-01
KLA TENCOR TECH CORP
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  • Abstract
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Problems solved by technology

However, the accuracy and / or repeatability of overlay measurements of overlay targets can be highly sensitive to variations in process parameters such as, but not limited to, the thickness of film layers
Thus, process parameter variations, even within selected manufacturing tolerances, may cause variations in the accuracy and / or repeatability of overlay measurements across the surface of the sample, and thus may negatively affect overall overlay performance

Method used

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  • Overlay metrology using multiple parameter configurations
  • Overlay metrology using multiple parameter configurations
  • Overlay metrology using multiple parameter configurations

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Embodiment Construction

[0019] Reference will now be made in detail to the disclosed subject matter, which is illustrated in the accompanying drawings. The invention has been particularly shown and described with respect to certain embodiments and specific features thereof. The embodiments set forth herein are to be regarded as illustrative and not restrictive. It should be readily apparent to those skilled in the art that various changes and modifications in form and details can be made without departing from the spirit and scope of the invention.

[0020] Embodiments of the invention relate to sequentially analyzing overlay targets on a sample by rapidly acquiring multiple overlay measurements for each overlay target using different recipes of overlay metrology tools, and generating an output for each overlay target based on the multiple overlay measurements overlay. For example, an overlay metrology system can acquire multiple overlay signals using different recipes of an overlay metrology tool ...

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Abstract

An overlay metrology system includes an overlay metrology tool configurable to generate overlay signals with a plurality of recipes and further directs an illumination beam to an overlay target and collects radiation emanating from the overlay target in response to the at least a portion of the illumination beam to generate the overlay signal with the particular recipe. The overlay metrology system further acquires two or more overlay signals for a first overlay target using two or more unique recipes, subsequently acquires two or more overlay signals for a second overlay target using the twoor more unique recipes, determines candidate overlays for the first and second overlay targets based on the two or more overlay signals for each target, and determines output overlays for the first and second overlay targets based on the two or more candidate overlays for each target.

Description

technical field [0001] The present invention relates generally to overlay metrology, and more particularly to overlay metrology employing multiple parameter configurations. Background technique [0002] Overlay metrology systems typically characterize the overlay alignment of multiple layers of a sample by measuring the relative positions of overlay target features located on the layer of interest. Furthermore, the overlay alignment of multiple layers is typically determined by aggregating overlay measurements of multiple overlay targets at various locations across the sample. However, the accuracy and / or repeatability of overlay measurements of overlay targets may be highly sensitive to variations in process parameters such as, but not limited to, the thickness of film layers. Thus, process parameter variations, even within selected manufacturing tolerances, may cause variations in the accuracy and / or repeatability of overlay measurements across the surface of the sample, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L23/544
CPCG03F7/70633G03F7/70616G02B5/1828G02B27/4244G02B27/286G01J3/0208G01J3/0229G01J3/0237G01J3/0289G01J3/10G01J2003/1213G01J2003/1221G01J3/18G01J3/14H01L22/12H01L22/30H01L23/544G01N21/4788G01N21/4795G02B27/1013G01N2021/8461G02B3/0006G01N2021/4709G01N2021/4711G02B27/4205G01B11/14
Inventor A·V·希尔A·舒杰葛洛夫A·玛纳森N·沙皮恩
Owner KLA TENCOR TECH CORP
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