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Mini-LED full-automatic die bonder and a die bonding method thereof

A mini-led, 1.mini-led technology, applied in the direction of conveyor objects, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of slow speed, slow work efficiency, low efficiency, etc., and achieve simple operation and management Convenience and the effect of improving enterprise efficiency

Active Publication Date: 2018-10-02
中山市新益昌自动化设备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it needs to go through multiple transfers, so that the work efficiency is slow; at the same time, it uses a single die-fixing mechanism to perform die-bonding on the LED bracket, which is low in efficiency and slow in speed.

Method used

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  • Mini-LED full-automatic die bonder and a die bonding method thereof
  • Mini-LED full-automatic die bonder and a die bonding method thereof
  • Mini-LED full-automatic die bonder and a die bonding method thereof

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Embodiment Construction

[0054] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0055] Please refer to Figure 1 to Figure 15 , the present embodiment provides a mini-LED automatic die bonding machine with fast die bonding speed and high work efficiency and a die bonding method thereof.

[0056] The mini-LED automatic crystal bonding machine and its crystal bonding method include a platen 1 and a feeding mechanism 2 and a receiving mechanism 4 arranged at both ends of the platen 1, and the feeding mechanism 2 and the receiving mechanism 4 A plurality of crystal-bonding units 3 are arranged between them.

[0057] The feeding mechanism 2 includes a material storage component 2-1, a feeding component 2-2 is arranged behind the...

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Abstract

The invention discloses a mini-LED full-automatic die bonder and a die bonding method thereof. The full-automatic die bonder comprises a platen and a feeding mechanism and a receiving mechanism respectively arranged at two ends of the platen; and multiple die bonding units are arranged between the feeding mechanism and the receiving mechanism. An LED bracket is conveyed to the adjacent die bondingunit through the feeding mechanism, each die bonding unit performs twice die bonding on the LED bracket, and then conveys the same to the next die bonding unit until the die bonding of the LED bracket is finished; the receiving mechanism receives the LED bracket after the die bonding is finished. For the die bonding way of the LED bracket needing to perform the die bonding of multiple LED chips,the die bonder disclosed by the invention reduces the transit loops of multiple die bonding in comparison with the traditional die bonding way, the production efficiency is greatly improved, the reject ratio is reduced; and the die bonder is compact in structure and small in floor area.

Description

technical field [0001] The invention relates to the technical field of LED processing, in particular to a mini-LED automatic crystal bonding machine and a crystal bonding method thereof. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a luminous element capable of converting electrical energy into light energy. LED products can be used in many fields such as lighting, display, and signal indication. In recent years, with the advancement of LED chip and packaging technology, the LED spacing used to display the screen can be reduced, and the small-pitch LED display can have higher resolution and better picture effects. Therefore, customers are more interested in small-pitch LED displays. demand is increasing. However, due to the narrowing of the pitch of the small-pitch LED display, the number of LEDs used in the same area of ​​the LED display has increased significantly, so there is a higher requirement for the die-bonding speed of the di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L21/677H01L21/67
CPCH01L33/48H01L21/67173H01L21/67745H01L2933/0033
Inventor 胡新荣胡新平梁志宏陈玮麟
Owner 中山市新益昌自动化设备有限公司
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