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Coverlay film

A covering film and body film technology, applied in the direction of film/sheet release coating, film/sheet adhesive, application, etc., can solve the problems of poor processing suitability, poor operability, lack of flexibility, etc., and achieve bending Excellent properties, reduced defects, and high flexibility

Active Publication Date: 2018-10-09
FUJIMORI KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a thin polyimide film has problems of poor processability in the manufacturing process and poor handleability when attached to FPC
[0005] In addition, in the conventional cover film, since it is difficult to make the thickness thinner and lacks flexibility, the followability to the step of the FPC is insufficient, gaps are generated, and problems such as expansion during the heating process are caused.
Therefore, it is difficult to sufficiently reduce the thickness of the entire FPC bonded with the cover film.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] A polyethylene terephthalate (PET) film having a thickness of 50 μm that was subjected to a release treatment on one surface was used as the support film 11 .

[0093] A solvent-soluble polyimide that does not contain a phosphorus-based flame retardant and is made of a flame-retardant polyimide resin (polyimide resin that does not contain aliphatic units) so that the thickness after drying becomes 1 μm. The resin coating solution was cast-coated on one surface of the support film 11 and dried to form the first insulating layer 12 .

[0094] Highly extensible polyimide resin (containing (CH 2 CH 2 CH 2 CH 2 -O-) 10 Coating solution of a solvent-soluble polyimide resin that does not contain a flame retardant and has a tensile elongation after drying of 170% formed as an aliphatic unit polyimide resin), cast coating On the first insulating layer 12, it was dried, and the second insulating layer 13 was formed.

[0095] 2.4 parts by weight of polyfunctional epoxy resin...

Embodiment 2、3

[0097] Except that the polyimide resin contained in the first insulating layer 12 is set to use the above-mentioned highly extensible polyimide resin and the above-mentioned flame-retardant polyimide resin at the same time, and in Example 2, the resin In Example 3, the weight ratio of the resin was 20:80 and the weight ratio of the resin was 50:50, and the cover films of Examples 2 and 3 were obtained in the same manner as in Example 1.

Embodiment 4

[0099] Except that the coating solution for forming the second insulating layer 13 is a coating solution of a solvent-soluble polyimide resin containing 20 parts by weight of a phosphorus-based flame retardant with respect to 100 parts by weight of the resin, in the same manner as in the implementation In the same manner as Example 3, the covering film of Example 4 was obtained.

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Abstract

The present invention provides a coverlay film which is excellent in processing suitability, operability and adherence to FPC even if the coverylay film is a thin film. The coverlay film is characterized in that, a first insulating layer (12), a second insulating layer (13) and a thermosetting adhesive layer (14) are sequentially laminated on one surface of a support film (11),, wherein the firstinsulating layer (12) contains a flame retardant resin. The tensile elongation of a laminate (15) formed by the first insulating layer (12), the second insulating layer (13) and the thermosetting adhesive layer (14) without the support film (11) is over 100%.

Description

technical field [0001] The present invention relates to a covering film. More specifically, the present invention relates to a flexible printed circuit board (hereinafter, referred to as FPC) which has good processability and lamination workability in the process of manufacturing a base material, and is excellent in followability to irregularities or steps of a flexible printed circuit board (hereinafter referred to as FPC). Thin film cover film. Background technique [0002] In mobile electronic devices such as mobile phones, electronic components are integrated on printed substrates in order to reduce the external dimensions of the casing, suppress the thickness and make it easy to carry. Further, in order to reduce the external dimensions of the case, the printed board is divided into multiple parts, and a flexible FPC is used for the connection line between the divided printed boards, thereby folding or sliding the printed board. [0003] In addition, since recent mobi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J7/30C09J7/50H05K3/28
CPCH05K3/28C09J7/255C09J7/30C09J7/50C09J175/04C09J2479/083C09J2463/00C09J2467/006C09J2475/00C09J2203/318C09J2301/122C09J2301/408C08L63/00C08K3/36B32B27/08B32B7/12B32B27/18B32B7/06B32B27/281B32B2457/08B32B2307/514B32B2307/206
Inventor 竹山早苗野村直宏樱木乔规
Owner FUJIMORI KOGYO CO LTD
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