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Substrate adhesion preventing film, platen, and method for substrate transportation

A technology for substrates and films, applied in microlithography exposure equipment, instruments, photolithography process of pattern surface, etc. Effect

Active Publication Date: 2022-03-18
ADTEC ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to the research of the inventors, since this resin film cannot be screwed, it needs to be fixed to the table by a method such as vacuum suction.
If the resin film is shifted, the position of the substrate on it is also shifted, so it is likely to become a cause of defective products in the case of processing that requires high positional accuracy such as exposure processing

Method used

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  • Substrate adhesion preventing film, platen, and method for substrate transportation
  • Substrate adhesion preventing film, platen, and method for substrate transportation
  • Substrate adhesion preventing film, platen, and method for substrate transportation

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Embodiment Construction

[0030] Next, specific embodiments of the present application (hereinafter referred to as embodiments) will be described.

[0031] figure 1 It is a schematic perspective view of the anti-substrate adhesion film of the embodiment and the platen of the embodiment using the anti-substrate adhesion film. figure 2 It is a schematic cross-sectional front view showing the use state of the substrate adhesion prevention film.

[0032] figure 1 and figure 2 The shown substrate sticking prevention film 1 is a film that covers the substrate placement area of ​​the stage 2 on which the substrate to be processed is placed. The substrate adhesion prevention film (hereinafter simply referred to as the prevention film) 1 is made of a transparent resin such as PET, and has a thickness of about 50 to 350 μm.

[0033] In this embodiment, the platen 2 has a square table shape, and a substrate is placed on the upper surface. It is assumed that the substrate to be placed is also a square shape...

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Abstract

The purpose is to prevent the substrate with high adhesiveness from adhering to the platen, so that there is no shape defect of the substrate or release of waste, the burden on the running cost is small, the installation and replacement are easy, and the positional deviation of the substrate is also small. able to cope effectively. A resin-made substrate adhesion preventing film (1) having a substrate suction hole (11) at a position corresponding to each substrate vacuum suction hole (21) of the stage (2) to hold the substrate of the stage (2) Set state configuration for region (R) overrides. A sensor (3) inside the platen (2) detects the deviation of a mark (12) provided on the substrate adhesion preventing film (1). In the case where the substrate adhesion preventing film (1) is misaligned, the carrying-in operation of the substrate (W) is stopped. The substrate adhesion prevention film (1) is vacuum-adsorbed on the platen (2) through the vacuum-adsorption hole (25) for the film.

Description

technical field [0001] The present invention relates to handling of substrates in the manufacturing process of various products, and particularly relates to a technique of placing and handling substrates on a platen. Background technique [0002] In the manufacture of various articles, a plate-like member (collectively referred to in this application as a substrate) is often handled as a base. The substrate may also remain and be included in the final product like a printed circuit board or a liquid crystal substrate, but may be removed during the manufacturing process without remaining. [0003] In such a manufacturing process for handling a substrate, the substrate is often placed on the surface of a member called a platen. In the present application, the term "platen" is a general term for a table-shaped member on which a substrate is placed. [0004] For example, in photolithography for forming fine shapes on a substrate, an exposure apparatus is used that irradiates t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70708G03F7/70716G03F7/70991G03F7/70825
Inventor 名古屋淳目黑崇
Owner ADTEC ENG