Substrate adhesion preventing film, platen, and method for substrate transportation
A technology for substrates and films, applied in microlithography exposure equipment, instruments, photolithography process of pattern surface, etc. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0030] Next, specific embodiments of the present application (hereinafter referred to as embodiments) will be described.
[0031] figure 1 It is a schematic perspective view of the anti-substrate adhesion film of the embodiment and the platen of the embodiment using the anti-substrate adhesion film. figure 2 It is a schematic cross-sectional front view showing the use state of the substrate adhesion prevention film.
[0032] figure 1 and figure 2 The shown substrate sticking prevention film 1 is a film that covers the substrate placement area of the stage 2 on which the substrate to be processed is placed. The substrate adhesion prevention film (hereinafter simply referred to as the prevention film) 1 is made of a transparent resin such as PET, and has a thickness of about 50 to 350 μm.
[0033] In this embodiment, the platen 2 has a square table shape, and a substrate is placed on the upper surface. It is assumed that the substrate to be placed is also a square shape...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


