Integrated radiator having temperature gradient
A temperature gradient, integrated technology, applied in the direction of electrical solid devices, semiconductor devices, semiconductor/solid state device components, etc., can solve the problems of cumbersome assembly, many heat dissipation parts, poor heat dissipation effect, etc., to facilitate the layout design, The effect of meeting heat dissipation needs and saving assembly procedures
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2018-10-09
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The invention belongs to the technical field of heat dissipation, and specifically relates to an integrated radiator with a temperature gradient. Background technique
[0002] With the continuous development of robot technology, the functions of robots are becoming more and more powerful to meet various complex application requirements. The ensuing problem is that the internal structure of the robot is becoming more and more complex, and there are more and more heat-generating components. The rapid increase in heat generation causes the ambient temperature inside the robot to remain high, which seriously affects the normal work of the robot.
[0003] Among them, the driver is one of the parts where the heat is most concentrated. The driver is used to realize the servo drive and control of the robot. There are a large number of electronic and electrical devices inside, which generate a lot of heat, but are very sensitive to the working temperature env...
Examples
Embodiment 1
[0031] Please refer to Figure 1~2 , this embodiment discloses an integrated radiator with temperature gradient (hereinafter referred to as "integrated radiator") 1000, which is arranged between the high-temperature device 2000 and the low-temperature device 3000, and realizes the partition on the integrated structure in a thermal isolation manner Heat dissipation, forming different temperature zones with constant temperature difference and stable temperature gradient, meeting the heat dissipation requirements of the high temperature device 2000 and the low temperature device 3000.
[0032] The integrated heat sink 1000 includes a first heat dissipation unit 0100 and a second heat dissipation unit 0200 fixed integrally, and the first heat dissipation unit 0100 and the second heat dissipation unit 0200 are physically connected but thermally isolated. In other words, the first heat dissipation unit 0100 and the second heat dissipation unit 0200 are physically integrated to achie...