Integrated radiator having temperature gradient

A temperature gradient, integrated technology, applied in the direction of electrical solid devices, semiconductor devices, semiconductor/solid state device components, etc., can solve the problems of cumbersome assembly, many heat dissipation parts, poor heat dissipation effect, etc., to facilitate the layout design, The effect of meeting heat dissipation needs and saving assembly procedures

Pending Publication Date: 2018-10-09
QKM TECH (DONG GUAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the ambient temperature of low-temperature devices and high-temperature devices is very different, the existing technology generally needs to dissipate heat separately. There are many heat-dissipating devices, and the assembly is very cumbersome.
Moreover, the space environment and the distribution of device locations are severely restricted, and the heat dissipation effect is not good.

Method used

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  • Integrated radiator having temperature gradient
  • Integrated radiator having temperature gradient
  • Integrated radiator having temperature gradient

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Please refer to Figure 1~2 , this embodiment discloses an integrated radiator with temperature gradient (hereinafter referred to as "integrated radiator") 1000, which is arranged between the high-temperature device 2000 and the low-temperature device 3000, and realizes the partition on the integrated structure in a thermal isolation manner Heat dissipation, forming different temperature zones with constant temperature difference and stable temperature gradient, meeting the heat dissipation requirements of the high temperature device 2000 and the low temperature device 3000.

[0032] The integrated heat sink 1000 includes a first heat dissipation unit 0100 and a second heat dissipation unit 0200 fixed integrally, and the first heat dissipation unit 0100 and the second heat dissipation unit 0200 are physically connected but thermally isolated. In other words, the first heat dissipation unit 0100 and the second heat dissipation unit 0200 are physically integrated to achie...

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PUM

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Abstract

An integrated radiator having a temperature gradient is arranged between a high temperature device and a lower temperature device and includes a first radiating unit and a second radiating unit fixedintegrally. The first radiating unit is used for keeping the high temperature device in a first temperature range. The second radiating unit is used for keeping the low temperature device in a secondtemperature range. A heat conduction path of the first radiating unit is isolated from that of the second radiating unit. The first radiating unit and the second radiating unit are in physical connection and in heat isolation. According to the invention, gradient radiation in different zones is realized with the integral structure. At the same time, radiation requirements of the low temperature device and the high temperature device are met at the same time, assembly procedures are reduced and device layout design is facilitated.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and specifically relates to an integrated radiator with a temperature gradient. Background technique [0002] With the continuous development of robot technology, the functions of robots are becoming more and more powerful to meet various complex application requirements. The ensuing problem is that the internal structure of the robot is becoming more and more complex, and there are more and more heat-generating components. The rapid increase in heat generation causes the ambient temperature inside the robot to remain high, which seriously affects the normal work of the robot. [0003] Among them, the driver is one of the parts where the heat is most concentrated. The driver is used to realize the servo drive and control of the robot. There are a large number of electronic and electrical devices inside, which generate a lot of heat, but are very sensitive to the working temperature env...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/433H01L23/467
CPCH01L23/3672H01L23/4334H01L23/467
Inventor 刘江沙琪陈理辉郑荣魁杜惠雷宇王彬
Owner QKM TECH (DONG GUAN) CO LTD
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