Multilayer wiring board and differential transmission module
一种多层布线基板、传输模块的技术，应用在传输系统、数字传输系统、基带系统等方向，能够解决得不到高速信号传输特性等问题，达到良好传输特性的效果
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Embodiment 1
[0049] Below, use Figure 1 to Figure 5 The structure of the multilayer wiring board according to the first embodiment will be described. figure 1 is a top view showing the through-hole structure of the multilayer wiring board according to the first embodiment, figure 2 , Figure 4 yes figure 1 The A-A line sectional view, image 3 yes figure 1 The B-B line sectional view, Figure 5 is showing figure 1 A diagram showing the wiring pattern of each layer of the multilayer wiring board.
[0050] about Figure 1 to Figure 5 The illustrated multilayer wiring board is assumed to be a chip board used for connectors related to high-speed wired transmission. A resin substrate in which resin layers having different thicknesses are stacked can be suitably used as the multilayer wiring substrate of the chip substrate. Thereby, without using high-cost materials such as ceramics, both high-density wiring and improvement in substrate strength can be achieved.
[0051] Such as fi...
Embodiment 2
[0068] Below, use Figure 6A , Figure 6B , Figure 7 , Figure 8 The structure of the multilayer wiring board according to the second embodiment will be described. Figure 6A is a diagram showing via holes and gaps formed in the multilayer wiring board according to Embodiment 1, Figure 6B is a diagram showing via holes and gaps formed in the multilayer wiring board according to the second embodiment, Figure 7 It is a diagram showing the relationship between the angle θ formed by the virtual line 40 connecting the differential pairs of the vias 12 of the core layer 23 and the line perpendicular to the signal propagation direction of the differential wiring, and Wclr and Lclr. In Embodiment 1, the structure in which the via-hole pairs 12 of the core layer 23 are arranged so that the imaginary line 40 connecting the centers of the differential pairs of the via-holes 12 of the core layer 23 is parallel to the signal propagation direction is described. . In Example 2, the ...
Embodiment 3
[0081] In Example 2, since the imaginary line 40 connecting the centers of the differential pairs of through-holes in the core layer 23 is arranged to be inclined from the state of Example 1 (see Figure 6B ), so in the core layer 23, the gap width (Wclr) with respect to the direction perpendicular to the signal propagation direction expands in the direction in which the width of the multilayer wiring substrate is limited. Therefore, for example, in the case of θ=45°, there are cases where a given via hole 12 or gap 14 is not contained within the wiring board area.
[0082] In the third embodiment, a configuration in which the phantom line 50 connecting the centers of the differential pairs of the vias 11 of the build-up layer 22 is arranged to be inclined from the states of the first and second embodiments will be described.
[0083] exist Figure 16 A top view of the multilayer wiring substrate according to the third embodiment is shown. In the multilayer wiring board acco...
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