Pulse laser perforating device and perforation method thereof

Abstract

The invention discloses a pulse laser perforating device and a perforation method thereof. The pulse laser perforating device comprises a pulse laser perforating device body; the pulse laser perforating device body is provided with a device cabinet body, an electric control cabinet, a bracket, a steering motor, a connector, a pulse head bracket, a control computer, a laser pulse head, a pulse headdriving seat, a horizontal driving guide rail, a wire penetrating groove, a pulse head mounting groove, a driving motor, a rail groove, a laser oscillator, a reflecting mirror, an air compressor, a light collecting groove, a laser lens, an injector head, a laser power supply and a cooling water device; the pulse head bracket is installed above the pulse laser perforating device body; the laser pulse head can move back and forth inside the horizontal driving guide rail; different positions on the stainless steel can be perforated; the frequency of the laser pulse head on the device is set to be 1 HZ to 1000 HZ; the duty ratio is set to be 1% to 90%; the material is pierced in a short time; no splattering is generated in perforation; and the phenomenon of abrasion of a nozzle is prevented.

Description

technical field [0001] The invention relates to the technical field of pulse laser perforation, in particular to a pulse laser perforation device and a perforation method thereof. Background technique [0002] Conventional laser perforation technology uses a continuous laser beam to ablate the workpiece to melt the workpiece to form a process hole. Its shortcoming is that: due to the continuous melting of materials for hole processing by continuous laser beams, the workpiece melt continuously transfers heat to the base material, and the diameter of the molten pool on the surface of the workpiece is much larger than the diameter of the spot, while the diameter of the molten pool at the bottom of the molten pool and the diameter of the spot Close, so the formed hole is often tapered, and the shape accuracy of the hole is not easy to control; at the same time, because the workpiece is continuously heated, the material of the hole wall is greatly affected by the heat; Accumulat...

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Problems solved by technology

Its shortcoming is that: due to the continuous melting of materials for hole processing by continuous laser beams, the workpiece melt continuously transfers heat to the base material, and the diameter of the molten pool on the surface of the workpiece is much larger than the diameter of the spot, while the diameter of the molten pool at the bottom of the molten pool and the diameter of the spot Close, so the formed hole is often tapered, and the shape accuracy of the hole is not easy to control; at the same time, because the workpiece is continuously heated, the material of the hole wall is greatly affected by the heat; Accumulation, forming bulges after cooling, affects the processing quality of the workpiece, so follow-up processing is often required to ensure the quality of the workpiece

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