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Construction method of electronic chip plant waffle slab structure

A technology of electronic chips and waffle boards, which is applied to floors, building components, building structures, etc., can solve problems such as failure to meet FM certification, protracted process duration, difficulty in steel bar binding, etc., and achieve fast hanging operations or horizontal movement , The storage turnover space is small, and the effect of meeting the tight schedule of the factory building

Inactive Publication Date: 2018-10-12
CHENGDU CONSTR ENG GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, SMC (glass fiber reinforced plastic) formwork is used as the tube of the waffle plate, but due to the limitation of the production process, it is impossible to make products with the same upper and lower calibers, and the mold opening cycle is as long as 60 days, after the mold is opened, the daily output of each mold is 250m 2 , the construction speed is slow; and if SMC formwork is used, the waffle board must be placed first, and then the steel bars will be installed. It will be very difficult to bind the steel bars, and the length of the related process will greatly extend the construction period; SMC formwork will produce toxic and harmful gases at high temperatures, and it will also Unable to meet the relevant requirements of FM certification

Method used

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  • Construction method of electronic chip plant waffle slab structure
  • Construction method of electronic chip plant waffle slab structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] In this embodiment, the flatness of the bottom mold template 1 is adjusted before step C is performed, and the flatness of the bottom mold template 1 is calibrated simultaneously by measuring with a level instrument and drawing cross lines. In the construction process, the "double control" method of pulling the cross line and the level can not only meet the requirements of the area flatness detection, but also avoid human error and instrument error, which can not only ensure the construction efficiency, but also increase the reliability of the detection. Can significantly improve the flatness of the template. When pulling the cross line, use the theodolite to lead the axis control line to the wooden formwork surface, and check again, the error shall not be greater than 2mm, each axis is used as the control line, and the control line releases the vertical and horizontal axes at intervals of 4.8×4.8m.

[0049] Before step C, adjust the flatness of the template to make it ...

Embodiment 2

[0051] In this embodiment, the hole spacing of the waffle plate is 600mm, and the beams of 200mm×800mm are covered between the cylinder and the cylinder, with a height of 800mm. Therefore in the D step, tie the steel bars 3 overhead by the span, first bind the main beam steel bars 3 and the secondary beam bars, and then tie the waist bars. The site adopts vertical and horizontal span-based tying construction: place the lower cover of the Kistler tube 2ABS on the front line of tying, and then tie the main beam reinforcement 3 and the secondary beam reinforcement one by one in the sky, and then drop it into the mold after completion. After all the beams in the same direction are completed, use the same method to bind the beams in the other direction. The waist tendons are not tied for the time being, and the ribs will be tied after the beams are tied in place. In addition, during the binding construction of steel bars 3, the steel bars 3 should not be stacked together, and shou...

Embodiment 3

[0053] In this embodiment, the 2 shells of the Qishi cylinder are installed one by one, and one is successfully installed, and then the next one is installed. The aforementioned installation method can effectively avoid damage due to weak strength of the body wall of the Qishi cylinder 2. The gap between the cylinder body and the base is sealed with waterproof putty, and the gap with the upper cover is sealed with adhesive tape, which can effectively prevent the phenomenon of slurry leakage. The putty must be tightly sealed without cracking; the adhesive tape must be firmly pasted and there is no phenomenon that the outside is turned up.

[0054] After checking the position of steel bar 3 is correct, check that the Qishi cylinder 2 is not damaged or deformed, put the cylinder on the lower cover, tighten the screw and the chassis, install the upper cover, tighten the nuts, and fix it on the bottom formwork. Use the ruler, feeler gauge and level to check the elevation of the top...

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Abstract

The invention discloses a construction method of an electronic chip plant waffle slab structure, particularly relates to a construction method of the electronic chip plant waffle slab structure, and belongs to the field of electronic chip plant building. The construction method comprises the following steps that A, a waffle slab formwork supporting system is erected; B, a bottom formwork is laid;C, a cheese tube is positioned on the bottom formwork, and a base plate and a base of the cheese tube are mounted on the bottom formwork; D, waffle slab steel bar binding is conducted; E, a tube bodyand accessories of the cheese tube are mounted on the base; F, concrete pouring is conducted; G, concrete surface leveling curing is conducted; H, the supporting system is dismantled; J, the base andthe base plate of the cheese tube are dismantled; K, a top cover of the cheese tube is dismantled; and L, pollutants left on the cheese tube are cleared away. According to the construction method of the electronic chip plant waffle slab structure, construction is convenient and quick, the construction precision is high, the structure is stable, the quality is reliable, and the demands of a clean room for the cleanliness class can be met.

Description

technical field [0001] The invention relates to a construction method for a waffle board structure of an electronic chip factory building, in particular to a construction method for a waffle board structure of an electronic chip factory building in the field of electronic chip factory building construction. Background technique [0002] With the development of the electronic chip industry, more and more large-scale electronic factory buildings are being built for the production of electronic chips. This type of chip factory building has high cleanliness, anti-vibration, large single building volume, tight construction period requirements, and floor flatness requirements. Higher common features. In the existing technology, the waffle board can provide a dust-free structural base layer for the factory building with high cleanliness requirements, while ensuring smooth exhaust channels, and can also meet the requirements of the factory building for anti-vibration. Some large-sc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B5/36E04B5/38
CPCE04B5/36E04B5/38
Inventor 李文波田明冰周豫周敏纪扬吴德艮李燮靳福兴李果罗利牛亮黄欢欢
Owner CHENGDU CONSTR ENG GROUP CORP
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