The application provides a complete
assembly for a magnetron
sputtering process cavity, which comprises an integrated
cavity liner, a process adapter, a
ceramic ring and a gas path pipeline
assembly; an upper part of an outer wall of the integrated
cavity liner is extended to form a boss, a plurality of first air holes are provided through the boss in a radial direction, and a plurality of second air holes are provided through the boss below the boss in the radial direction; a first step and a second step are formed on an inner wall of the process adapter; the process adapter is formed with a first gas path hole and a second gas path hole in the radial direction, and a second sealing ring is arranged on the second step; when the integrated
cavity liner is assembled to the process adapter, a bottom surface of the boss is arranged on the second step, the first gas path hole is communicated with the first air hole, the second gas path hole is communicated with the second air hole, and the second sealing ring blocks the communication between the first gas path hole and the second gas path hole; the
ceramic ring covers the boss and the first step; and the gas path pipeline
assembly is connected with the first gas path hole and the second gas path hole respectively.