Copper-based IMS-embedded radiating substrate and preparation method thereof

Abstract

The invention discloses a copper-based IMS-embedded radiating substrate. The copper-based IMS-embedded radiating substrate comprises a substrate body and a copper-based insulating plate, wherein the substrate body comprises a first FR4 inner layer plate, a bonding sheet and a second FR4 inner layer plate from top to bottom, the substrate body is provided with a through slot position, the copper-based insulating plate is embedded in the slot position, the upper surface of the copper-based insulating plate is flat with the upper surface of the substrate body, and the lower surface of the copper-based insulating plate is flat with the lower surface of the substrate body; and a longitudinal insulating layer is arranged between the copper-based insulating plate and the substrate longitudinally.The copper-based IMS-embedded radiating substrate has the advantages that the copper-based insulating plate is directly embedded / buried in an epoxy resin multilayer pate, the radiating substrate hasa heat dissipation function and effect of a copper-embedded block and has a surface insulating effect of the aluminium nitride, can make a metal circuit graph and has high-power small-size local heattransfer function.

Description

technical field [0001] The invention relates to the technical field of a heat dissipation substrate, in particular to a production technology of a heat dissipation substrate embedded with a copper-based IMS. Background technique [0002] At present, the PCB (printed circuit board) market has a local heat dissipation design, which is mainly a copper embedded circuit board and an aluminum nitride ceramic embedded ceramic circuit board. Embedding copper blocks can directly embed heat dissipation modules with designed dimensions into the board, which can well solve the problem of local heat dissipation of high-power semiconductors on multi-layer PCBs. However, copper blocks have conductive properties, and graphics cannot be made on copper blocks. If required Module insulation and graphic production need to be completely embedded in the circuit board, and the PCB surface needs to use FR4 material (epoxy resin). According to this design, it can meet the requirements of insulation ...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a heat dissipation substrate embedded with copper-based IMS and its preparation method to solve the problems in the prior art that the surface of the embedded copper block cannot realize graphics, the processing of the embedded aluminum nitride ceramic substrate is difficult, and the cost is high.

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