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Pressure sensor, manufacturing method of pressure sensor, pressure sensor module, electronic device, and vehicle

A technology of pressure sensor and substrate, which is applied in the direction of measuring fluid pressure, manufacturing microstructure devices, microelectronic microstructure devices, etc., and can solve the problems of pressure detection accuracy reduction and other problems

Inactive Publication Date: 2018-10-16
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even if the same pressure is applied, the measured value will vary depending on the ambient temperature, which may reduce the pressure detection accuracy

Method used

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  • Pressure sensor, manufacturing method of pressure sensor, pressure sensor module, electronic device, and vehicle
  • Pressure sensor, manufacturing method of pressure sensor, pressure sensor module, electronic device, and vehicle
  • Pressure sensor, manufacturing method of pressure sensor, pressure sensor module, electronic device, and vehicle

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Experimental program
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no. 1 approach

[0059] First, the pressure sensor according to the first embodiment of the present invention will be described.

[0060] figure 1 It is a sectional view showing the pressure sensor according to the first embodiment of the present invention. figure 2 to represent figure 1 The top view of the sensor part of the shown pressure sensor. image 3 to indicate include figure 2 A diagram of the bridge circuit of the sensor section shown. Figure 4 to represent figure 1 An enlarged cross-sectional view of the sealing layer with which the pressure sensor is shown. Figure 5 to represent figure 1 Top view of the pressure sensor shown. Image 6 In order to indicate that the metal layer is changed from figure 1 A cross-sectional view of the structure with the pressure sensor removed is shown. Figure 7 for figure 1 An enlarged cross-sectional view of the metal layer included in the pressure sensor shown. Figure 8 to represent figure 1 A flowchart of the manufacturing process ...

no. 2 approach

[0145] Next, a pressure sensor according to a second embodiment of the present invention will be described.

[0146] Figure 20 It is a sectional view showing the pressure sensor according to the second embodiment of the present invention.

[0147] Except for the structure of the metal layer 48, the pressure sensor 1 according to this embodiment is basically the same as the pressure sensor 1 of the first embodiment described above.

[0148] Hereinafter, the pressure sensor 1 of the second embodiment will be described focusing on differences from the first embodiment described above, and descriptions of the same items will be omitted. In addition, the same code|symbol is attached|subjected to the same structure as embodiment mentioned above.

[0149] Figure 20 For the first embodiment described above Figure 7 The corresponding cross-sectional view shows a cross-section of the metal layer 48 . As shown in the figure, in this embodiment, the guard ring 441 has: two conca...

no. 3 approach

[0153] Next, a pressure sensor according to a third embodiment of the present invention will be described.

[0154] Figure 21 It is a sectional view showing the pressure sensor according to the third embodiment of the present invention. Figure 22 to Figure 25 respectively for the Figure 21 A cross-sectional view illustrating the method of manufacturing the pressure sensor is shown.

[0155] Except for the difference in the structure of the metal layer 48 , the pressure sensor 1 according to this embodiment is basically the same as the pressure sensor 1 of the first embodiment described above.

[0156] Hereinafter, the pressure sensor 1 of the third embodiment will be described focusing on differences from the first embodiment described above, and descriptions of the same items will be omitted. In addition, the same code|symbol is attached|subjected to the same structure as embodiment mentioned above.

[0157] Such as Figure 21 As shown, in the pressure sensor 1 of the...

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PUM

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Abstract

The present invention provides a pressure sensor capable of exhibiting excellent pressure detection accuracy, a method of manufacturing the same, a pressure sensor module, an electronic device, and avehicle. The pressure sensor includes a substrate having a diaphragm bent and deformed by pressure reception, a side wall portion disposed on one surface side of the substrate and surrounding the diaphragm in plan view of the substrate, a sealing layer disposed to face the diaphragm with space interposed between the sealing layer and the diaphragm and sealing the space, and a frame shaped metal layer positioned between the side wall portion and the sealing layer. The sealing layer includes a first sealing layer having a through-hole facing the space, and a second sealing layer positioned on aside opposite to the space with respect to the first sealing layer and sealing the through-hole, and an inner peripheral end of the metal layer is positioned between the through-hole and an outer edgeof the diaphragm in plan view of the substrate.

Description

technical field [0001] The invention relates to a pressure sensor, a manufacturing method of the pressure sensor, a pressure sensor module, electronic equipment and a moving body. Background technique [0002] Conventionally, the structure described in Patent Document 1 is known as a pressure sensor. The pressure sensor of Patent Document 1 includes: a substrate having a diaphragm that is flexibly deformed by pressure; and a surrounding structure disposed on the substrate with a pressure reference chamber formed therebetween. In addition, the surrounding structure has a frame-shaped wall surrounding the pressure reference chamber and a top portion covering the opening of the wall. In addition, the top has: a cover layer having through holes for release etching; and a sealing layer laminated on the cover layer and sealing the through holes. [0003] In a pressure sensor with such a structure, the sealing layer is made of a metal material such as Al or Ti (a material with a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L9/00G01L9/02G01L9/06
CPCG01L9/0051G01L9/0055G01L9/025G01L9/065G01L2009/0069G01L2009/0067G01L9/0054G01L9/0073G01L19/04B81B3/0072B81C1/00158B81C2201/0133B81B2201/0264B81B2203/0127
Inventor 林和也
Owner SEIKO EPSON CORP
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