Substrate processing system, substrate inversion device and method
A technology of a substrate processing system and a flipping device, which is applied in the field of substrate processing, can solve the problems of increasing substrate pollution and low substrate processing efficiency, and achieve the effects of reducing the probability of substrate contamination and improving substrate processing efficiency
Active Publication Date: 2021-11-12
雷仲礼
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Such a process leads to low substrate processing efficiency and increases the probability of substrate contamination
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[0053] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0054] It should be noted that the substrate described in the embodiment of the present application includes a plurality of rows of chips arranged in rows, and each row of chips includes a plurality of chips.
[0055] figure 1 It is a schematic diagram of the framework of the substrate processing system provided by the embodiment of the present application. Such ...
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The present application discloses a substrate turning device and a turning method. In addition, the present application also discloses a substrate processing system. An inversion chamber is provided in the substrate processing system, and a substrate inversion device is provided in the inversion chamber. When one surface treatment of the substrate is completed, the substrate is transferred from the substrate transfer device in the transfer chamber to the inversion chamber. The substrate inversion device in the inversion chamber can be used to realize the inversion of the substrate in a vacuum environment. After the inversion, the substrate is transferred by the substrate in the transfer chamber. The device is transferred to the process reaction chamber, and the other surface of the substrate is processed to complete the processing on the front and back sides of the substrate. In this way, the substrate processing system provided by the present application does not need to transfer the substrate to the outside of the system for inversion, and the substrate can be turned over in the substrate processing system through the inversion chamber and the substrate inversion device in the inversion chamber. Therefore, by the present application The provided substrate processing system can improve substrate processing efficiency and reduce substrate contamination probability.
Description
technical field [0001] The present application relates to the technical field of substrate processing, and in particular to a substrate reversing device and a reversing method, and a substrate processing system including the substrate reversing device. Background technique [0002] For substrates that need to be processed on both the front and back sides, such as photovoltaic solar cell substrates, after one side of the substrate is processed, the substrate needs to be turned over, and then the other side is processed. The existing substrate inversion needs to be completed by the substrate inversion device outside the substrate processing system. In this way, after the substrate is processed on one side, it needs to be cooled and transferred to the substrate inversion device outside the substrate processing system for inversion, and then placed in a On the new substrate carrier, in addition, the substrate needs to be re-preheated before entering another substrate process rea...
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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67161H01L21/67718H01L21/67745H01L31/18H01L21/67712H01L21/67715H01L21/67778H01L21/68728C23C16/4583B65G2201/0297B65G47/248
Inventor 雷仲礼
Owner 雷仲礼