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Micro-channel radiator structure and preparation method thereof

A heat sink and micro-channel technology, applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of low heat dissipation efficiency, simple structure of silicon-based micro-channels, and inability to meet chip heat dissipation, etc., to achieve Uniform heat dissipation capacity, strong heat dissipation effect, and uniform heat dissipation effect

Active Publication Date: 2018-10-16
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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AI Technical Summary

Problems solved by technology

However, the heat dissipation capability of a microchannel heat sink is closely related to its structure and manufacturing process. Ordinary silicon-based microchannels have a simple structure and low heat dissipation efficiency, which cannot meet the needs of future chip heat dissipation.

Method used

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  • Micro-channel radiator structure and preparation method thereof
  • Micro-channel radiator structure and preparation method thereof
  • Micro-channel radiator structure and preparation method thereof

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Embodiment approach

[0034] As an embodiment of the present invention, the distribution channels 3 are evenly arranged to make the cooling liquid spread evenly between the embedded channel 2 and the liquid inlet / outlet port 4 .

[0035] As an embodiment of the present invention, the width of the open channel 1 is the same as that of the embedded channel 2 .

[0036] The embedded channel 2 has a width of 5µm-100µm and a depth of 30µm-500µm. Preferably, the embedded channel 2 has a width of 10µm to 50µm and a depth of 100µm to 300µm. As an embodiment of the present invention, the width is 50 µm and the depth is 300 µm.

[0037] As an embodiment of the present invention, the depth of the branch flow channel 3 is the same as that of the embedded flow channel 2 .

[0038] As an embodiment of the present invention, the branch flow channel 3 is arranged inside the A silicon wafer.

[0039] Such as image 3 As shown, a method for preparing a microchannel heat sink structure is used to prepare the abov...

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Abstract

The invention provides a micro-channel radiator structure and a preparation method thereof. The micro-channel radiator structure comprises embedded flowing channels and a liquid inlet / liquid outlet formed in an A silicon wafer, wherein the A silicon wafer and a B silicon wafer are bonded together; the micro-channel radiator structure also comprises opening flowing channels and shunting flowing channels; the opening flowing channels are formed in the B silicon wafer, and are connected with a part of the embedded flowing channels in the A silicon wafer in a one-to-one correspondence manner; theopening flowing channels run through the B silicon wafer; and the shunting flowing channels are formed in the radiator, and are connected with the embedded flowing channels and the liquid inlet / liquidoutlet. Compared with the prior art, heat dissipation is more uniform, the heat dissipation effect is higher, and the heat dissipation heat flux density is greater than 600W / cm<2>; and when the heatflux density is 600W / cm<2>, the temperature rise of a chip on the surface of the radiator is less than 40 DEG C.

Description

technical field [0001] The invention relates to a microchannel radiator structure and a preparation method thereof, and relates to the technical field of microelectronic heat dissipation. Background technique [0002] With the increase of chip power and the improvement of integration level, the calorific value of the chip increases significantly; the traditional remote heat dissipation technology can no longer meet the heat dissipation requirements of high-power chips. Insufficient heat dissipation capacity will lead to lower chip efficiency and even lead to chip failure; therefore, it is necessary to adopt more efficient cooling technology. [0003] Microfluidic cooling technology is an emerging embedded chip-level enhanced cooling technology. It directly cools the chip through micro-scale continuous fluid, which minimizes the impact of thermal resistance between heat sinks on the heat dissipation efficiency in the remote heat dissipation mode, thereby greatly improving th...

Claims

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Application Information

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IPC IPC(8): H01L23/473
CPCH01L23/473
Inventor 张剑卢茜向伟玮李阳阳林佳陈显才
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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