Laminated structure of double-surface component and manufacturing method thereof, and the double-surface component
A laminated structure, double-sided technology, applied in the direction of electrical components, semiconductor devices, photovoltaic power generation, etc., can solve the problems of heavy packaging materials, cumbersome lamination process, poor lamination effect, etc., to reduce weight and installation The effect of low cost and manufacturing cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0058] See figure 2 As shown, a laminated structure of a double-sided module, the laminated structure includes a first encapsulation layer 11a, a double-sided battery 13a and a second encapsulation layer 14a, wherein, in order to further enhance the weather resistance, the laminated structure includes a fluoroplastic film layer , the fluoroplastic film layer is located above the first encapsulation layer.
[0059] In this embodiment, the laminated structure further includes a first encapsulation film layer 12a, and the first encapsulation film layer 12a is located between the first encapsulation layer 11a and the double-sided battery 13a. The first packaging film layer 12a is made of EVA material.
[0060]The first packaging layer is prepared from 30 parts by weight fiber cloth and 70 parts by weight of the first packaging powder coating, and the second packaging layer is prepared from 50 parts by weight fiber cloth and 50 parts by weight of the second packaging powder coati...
Embodiment 2
[0078] See image 3 As shown, in this embodiment 2, the laminated structure includes a fluoroplastic film layer 11b, a first packaging layer 12b, a first packaging adhesive film layer 13b, a double-sided battery 14b and a second packaging layer 15b, and the fluoroplastic film layer 11b Located above the first encapsulation layer 12b, the rest of the technical solution of this embodiment 2 is the same as that of the above-mentioned embodiment 1.
Embodiment 3
[0080] See Figure 4 As shown, in this embodiment 3, the laminated structure includes the first encapsulation layer 11c, the first encapsulation film layer 12c, the double-sided battery 13c, the second encapsulation layer 14c and the back sheet layer 15c, and the back sheet layer 15c is located on the second Below the encapsulation layer 14c, other technical solutions of the third embodiment are the same as those of the first embodiment above.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com