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RF shield with selectively integrated solder

A shielding, solder technology, applied in the fields of magnetic/electric field shielding, welding equipment, manufacturing tools, etc., can solve problems such as inconsistencies

Active Publication Date: 2018-10-23
爱法组装材料公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the location of the control solder quality may not be consistent

Method used

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  • RF shield with selectively integrated solder
  • RF shield with selectively integrated solder
  • RF shield with selectively integrated solder

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specific Embodiment approach

[0049] The present invention discloses a shield for protecting electronic components from electromagnetic and radio frequency interference, which is configured to provide sufficient solder volume to overcome the above-mentioned problem of insufficient solder volume.

[0050] In one embodiment, the shield includes pins configured to protect or shield the electronic component body and attached or integrated to the shield body, wherein the pins or tabs are configured to be attached by soldering to on the substrate.

[0051] In a preferred embodiment, the substrate is a printed circuit board. Other similar substrates can also be shielded using the shields of the present invention using the methods described herein. By providing a pin with solder already disposed on more than one of the shields, the reflow soldering action of the shield can be performed without the need to include, for example, dispensing solder paste, using pick and place solder prep with solder paste. Solder pr...

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Abstract

The invention relates to a shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attachedto a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.

Description

technical field [0001] The present invention generally relates to a method of attaching a shield to protect an electronic assembly from electromagnetic and radio frequency interference to a substrate by means of a shield having selectively integrated solder. Background technique [0002] Today's electronic components including, for example, resistors, capacitors and semiconductor components are often subject to undesired emissions, such as electromagnetic and radio frequency interference, e.g. from adjacent components that emit such interference, or from external Sources of electromagnetic and radio frequency interference. Emitted interference sources may adversely affect the performance and integrity of electronic components because these emitted interference can negatively affect the operation of electronic components by temporarily changing or distorting their essential characteristics. [0003] There are various methods that can be used to protect and shield electronic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H01L23/552
CPCH01L23/552H05K3/3431H01L2224/16227H01L2924/14H01L2924/16251H01L2924/16315H01L2924/19041H01L2924/19043H01L2924/19105H01L2924/3025H01L2924/3511H01L2924/3512H05K2201/0715H01L2924/165B23K3/0623B23K2101/42B23K1/0016B23K1/008H05K1/181H05K2201/10371Y02P70/50H05K9/0028B23K1/20H05K3/3494H05K9/0024H05K9/0081
Inventor P·J·考伊普M·T·马尔茨K·A·特里夫森
Owner 爱法组装材料公司