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Multilayer wiring substrate for probe cards, and probe card provided with same

A wiring substrate and probe card technology, applied in the field of probe cards, can solve problems such as difficult repair, generation of debris, and high risk of bad conditions, and achieve the effects of avoiding debris, reducing size, and lowering manufacturing costs

Active Publication Date: 2018-10-26
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, ceramic substrates are difficult to process, so for example, when dimensioning ceramic substrates for probe cards, problems such as chipping may occur
This type of ceramic substrate sometimes requires a thickness of several millimeters, but if the thickness of the ceramic substrate increases, the risk of failure during processing will further increase
In addition, dimensional processing is close to the final process, so there is also a problem that it is difficult to repair if a processing defect occurs in this process

Method used

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  • Multilayer wiring substrate for probe cards, and probe card provided with same
  • Multilayer wiring substrate for probe cards, and probe card provided with same
  • Multilayer wiring substrate for probe cards, and probe card provided with same

Examples

Experimental program
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no. 1 approach ＞

[0026] Reference figure 1 , figure 2 The probe card 1a according to an embodiment of the present invention will be described. In addition, figure 1 Is a cross-sectional view of the probe card 1a, figure 2 Is carried on figure 1 A cross-sectional view of the laminated wiring board 3a of the probe card 1a.

[0027] Such as figure 1 As shown, the probe card 1a according to this embodiment includes: a mother substrate 2; a multilayer wiring substrate 3a mounted on one main surface of the mother substrate 2; a plurality of probes 5 connected to the multilayer wiring substrate 3a at one end; and a support The probe 4 of each probe 5; and the fixing member 24 that fixes the probe 4 and the laminated wiring board 3a, and the probe card 1a is used for electrical inspection of an inspection object 50 such as a semiconductor element.

[0028] The mother board 2 is formed with a plurality of mounting electrodes 6 for mounting the multilayer wiring board 3a on one main surface. Here, eac...

no. 2 approach ＞

[0047] Reference Figure 5 , Image 6 The probe card 1b according to the second embodiment of the present invention will be described. In addition, Figure 5 Is a cross-sectional view of the probe card 1b, Image 6 It is a cross-sectional view of the multilayer wiring board 3b mounted on the probe card 1b.

[0048] The laminated wiring board 3b mounted on the probe card 1b according to this embodiment and the reference figure 1 , figure 2 The first embodiment described is different in that, as Figure 5 , Image 6 As shown, the lower surface 12 of the core substrate 7 is not covered by the resin portion 8. The other structure is the same as that of the multilayer wiring board 3a of the first embodiment, and therefore the description is omitted by denoting the same reference numerals.

[0049] In this case, the resin portion 8 is arranged so as to cover the side surface of the core substrate 7, and a through hole 22 is formed in the thickness direction of the resin portion 8 in or...

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Abstract

A multilayer wiring substrate for probe cards, which has a laminate of resin layers, and which is suppressed in the production cost by reducing the occurrence of defects such as chipping by covering aceramic substrate with a resin. A multilayer wiring substrate (3a) is provided with: a core substrate (7); a resin part (8) that covers a lateral surface and a lower surface (12) of the core substrate (7); and a plurality of metal pins (11) that are provided within the resin part (8). The core substrate (7) comprises: a ceramic laminate part (9) that is arranged on the mother substrate side; anda resin laminate part 10 that is laminated on a main surface (13) of the ceramic laminate part (9), the main surface being on the reverse side of the mother substrate-side surface. The resin part (8)is provided with the plurality of metal pins (11), and is also provided with a through hole (22) that penetrates therethrough in the thickness direction of the resin part (8). The multilayer wiring substrate (3a) is mounted on a mother substrate by inserting a fixation fitting (24) into the through hole (22).

Description

Technical field [0001] The present invention relates to a laminated wiring substrate having a ceramic layer and a probe card using the laminated wiring substrate. Background technique [0002] Conventionally, in a probe card used for electrical inspection of semiconductor elements, a multilayer wiring board has been used for rewiring between the probe and the mother board. Among such laminated wiring boards is a laminated wiring board having a ceramic laminated portion in which a plurality of ceramic layers are laminated. [0003] For example, such as Figure 8 As shown, the ceramic wiring board 100 described in Patent Document 1 includes a ceramic layer 101 in which a plurality of ceramic insulating layers 101a are laminated, and a resin layer 102 in which a plurality of insulating resin layers 102a are laminated. The ceramic wiring board 100 is A structure in which a resin layer 102 is laminated on the ceramic layer 101. In the resin layer 102, insulating resin layers 102 a and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46G01R1/073
CPCH05K1/0268H05K2201/068H05K2201/10409H01L2924/15174H05K1/0271H05K1/0306H05K3/4688H05K2201/096G01R1/07378G01R1/07314G01R1/073H01L23/15H01L23/49822H01L23/49827H05K1/0298
Inventor 竹村忠治川上弘伦
Owner MURATA MFG CO LTD