Heat radiation device, manufacturing method of heat radiation device and server

A heat dissipation device and server technology, which can be used in cooling/ventilation/heating transformation, instruments, electrical equipment structural parts, etc., can solve the problem of low heat dissipation efficiency of sealed chips, and achieve the effect of reducing the transmission path

Active Publication Date: 2018-11-06
HUAWEI TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] This application provides a heat dissipation device, its manufacturing method, and a server, which can solve the problem of low heat dissipation efficiency of heat dissipation for sealed chips in the related art. The technical solutions provided by this application are as follows:

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  • Heat radiation device, manufacturing method of heat radiation device and server
  • Heat radiation device, manufacturing method of heat radiation device and server
  • Heat radiation device, manufacturing method of heat radiation device and server

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Embodiment Construction

[0058] In order to make the purpose, technical solution and advantages of the present application clearer, the implementation manners of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0059] At present, multiple chips are generally packaged on the packaged chip, and the multiple chips include the main chip and other chips, and the thickness of the multiple chips is the same, wherein the heating power of the main chip is greater than that of other chips, for example: the The main chip can be a processor chip such as CPU or GPU on the packaged chip, and other chips can be HBM chips or other chips with less power consumption except the GPU on the packaged chip. In the related art, a heat dissipation device can be used to dissipate heat from the packaged chip. The heat dissipation device includes a heat dissipation substrate and a plurality of heat dissipation fins evenly arranged on the heat dissipation substrate....

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Abstract

The invention discloses a heat radiation device, a manufacturing method of the heat radiation device and a server, and belongs to the technical field of hardware heat radiation. The heat radiation device comprises a heat radiation base plate, a heat radiation assembly and a plurality of heat radiation fins, wherein the heat radiation fins are arranged on the first side of the heat radiation base plate, and are used for radiating the heat on the heat radiation base plate; the first surface of the heat radiation assembly is fixedly arranged on the second side of the heat radiation base plate; agap is formed between the side surface of the heat radiation assembly and the heat radiation base plate; the second surface of the heat radiation assembly is used for being attached to a first devicerequiring the heat radiation so as to radiate the heat on the first device requiring the heat radiation; a region which is not provided with the heat radiation assembly on the second side of the heatradiation base plate is used for being attached to other heat radiation devices; and the heating power of the first device requiring the heat radiation is greater than the heating power of other devices requiring the heat radiation; and other devices requiring the heat radiation are devices except for the first device requiring the heat radiation. Therefore the heat radiation efficiency of the heat radiation device is improved.

Description

technical field [0001] The invention relates to the technical field of hardware heat dissipation, in particular to a heat dissipation device, a manufacturing method thereof, and a server. Background technique [0002] With the continuous improvement of chip performance in the server, the heat generated by the chip is increasing. At the same time, due to the high integration of the internal components of the server, the heat in the server is highly concentrated. Therefore, how to effectively dissipate heat from the server is an urgent need. solved problem. [0003] The chips in the server may include: processing chips, and other low-power consumption chips such as memory chips. The processing chips may include a central processing unit (Central Process Unit; CPU) and a graphics processing unit (Graphics Processing Unit; GPU). It may include a high bandwidth memory (High Bandwidth Memory; HBM) chip and the like. Generally, processing chips, memory chips and other low power c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20H05K7/20518H05K7/20309H05K7/20809H05K7/20418H05K7/20709
Inventor 曹磊许寿标池善久
Owner HUAWEI TECH CO LTD
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