Cooling device for computer cooling module
A technology of a heat dissipation module and a cooling device, which is applied in the computer field, can solve the problems of shortening the service life of the computer and poor heat dissipation effect, and achieve the effect of prolonging the service life, efficiently dissipating heat, and ensuring normal use.
Active Publication Date: 2021-07-20
江苏傲龙信通科技有限公司
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Problems solved by technology
[0005] Aiming at the deficiencies of the prior art, the present invention provides a cooling device for a computer heat dissipation module, which solves the problems of poor heat dissipation effect and reduced service life of the computer
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[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] see Figure 1-6, the embodiment of the present invention provides a technical solution: a cooling device for a computer cooling module, including a chassis 1, both sides of the chassis 1 are provided with movable grooves 13, and the top and bottom of the inner wall of the movable groove 13 are fixedly connected with Dust-proof net 14, dust-proof net 14 can prevent the entry of dust, reduce the dust inside cabinet 1, the quantity of movable slot 13 is si...
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The invention discloses a cooling device for a computer heat dissipation module, which comprises a case, wherein both sides of the inner wall of the case are fixedly connected with semiconductor refrigeration sheets, and the opposite sides of the two semiconductor refrigeration sheets are fixedly connected with heat conduction rods, two The opposite ends of the heat conducting rods are fixedly connected with an elastic frame, and the top and bottom of the inner wall of the cabinet are fixedly connected with a horizontal plate, and the top and bottom of the elastic frame are fixedly connected with a fixing plate, which relates to the field of computer technology. The cooling device used for computer heat dissipation modules is fixedly connected with semiconductor cooling chips on both sides of the inner wall of the computer case, so as to realize fast and efficient heat dissipation for the computer case, thereby ensuring the normal use of the electrical components inside the computer. , There are movable slots on both sides of the chassis to avoid heat condensation inside the computer and only continue to heat up, and the heat can be dissipated to improve safety.
Description
technical field [0001] The invention relates to the technical field of computers, in particular to a cooling device for computer cooling modules. Background technique [0002] A computer, commonly known as a computer, is an electronic computing machine used for high-speed calculations. It can perform numerical calculations, logic calculations, and storage and memory functions. It is a modern intelligent electronic device that can run according to programs and process massive amounts of data automatically and at high speed. , is composed of hardware system and software system. Computers without any software installed are called bare metal, which can be divided into five categories: supercomputers, industrial control computers, network computers, personal computers, and embedded computers. More advanced computers include biological computers, Computers such as photonic computers and quantum computers are one of the most advanced scientific and technological inventions in the 2...
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IPC IPC(8): G06F1/20
CPCG06F1/20G06F1/183Y02D10/00
Inventor 杨勇罗程东志浩
Owner 江苏傲龙信通科技有限公司