A temperature monitoring method for an electrostatic adsorption disc
A technology of electrostatic adsorption and temperature control system, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc. It can solve the problems of wafer over-etching, under-etching, and inability to achieve temperature control, etc., achieving high accuracy, The effect of yield improvement
Active Publication Date: 2021-03-12
SHANGHAI HUALI MICROELECTRONICS CORP
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, such a temperature closed-loop control system cannot achieve effective temperature control when the temperature acquisition of the temperature sensor is distorted, which may lead to over-etching or under-etching of the wafer.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0033] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0034] In a preferred embodiment, as figure 1 As shown, a temperature monitoring method for electrostatic adsorption discs is proposed, which can be applied to such as figure 2 A temperature control system is shown, and the temperature control system is used to control the temperature of the electrostatic adsorption disc 1 of an etching machine;
[0035] The temperature control system may include a temperature sensor 10, a controller 20 and a heater 30 connected in sequence;
[0036] The temperature sensor is used to detect the temperature of the electrostatic adsorption disk 1, and the controller 20 controls the heating of the heater 30 according to the temperature of the electrostatic adsorption disk 1 detected by the temperature sensor 10;
[0037] The standard temperature line for the operation of the electrostatic adsorption disc 1 is preset in ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The present invention relates to the field of semiconductor technology, in particular to a temperature monitoring method of an electrostatic adsorption disc, comprising: step S1, obtaining the temperature of the electrostatic adsorption disc detected by a temperature sensor in real time, and the output power of a heater; step S2, judging the temperature detected by the temperature sensor Whether the temperature of the detected electrostatic adsorption disc deviates from the standard temperature line and exceeds the preset standard; if so, turn to step S4; if not, turn to step S3; step S3, judge whether the output power of the heater is within the standard power range; if so, Then return to step S1; if not, turn to step S4; step S4, stop the operation of the etching machine; by simultaneously monitoring the temperature of the electrostatic adsorption disc and the output power of the heater, the accuracy of temperature monitoring is high, which helps Yield improvement in wafer etching.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a temperature monitoring method for an electrostatic adsorption disc. Background technique [0002] In the existing wafer etching process, it is generally necessary to use an electrostatic adsorption plate to fix the wafer. During the process of etching the wafer, the temperature of the electrostatic adsorption plate needs to be strictly controlled. The temperature is controlled near the standard temperature line to ensure that the thickness of the etched wafer is controllable. [0003] The temperature sensor is used to detect the temperature of the electrostatic adsorption plate in real time, and the output power of the heater is controlled according to the detected temperature, so that the temperature of the electrostatic adsorption plate can be effectively controlled. However, such a temperature closed-loop control system cannot achieve effective temperature control un...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67248H01L21/6831
Inventor 钱洋洋昂开渠江旻任昱朱骏张旭升
Owner SHANGHAI HUALI MICROELECTRONICS CORP