Manufacturing method of pcb board with inner layer ultra-thick copper board
A technology of PCB board and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve problems such as difficult reduction, long manufacturing process, and increased process control difficulty, so as to reduce manufacturing cost and simplify the manufacturing process. Effect
Active Publication Date: 2020-12-01
CHENGYI ELECTRONICS JIAXING
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Problems solved by technology
However, the above-mentioned conventional production methods have defects, which are mainly reflected in that the production process is relatively long, it is not easy to reduce costs, and it increases the difficulty of process control.
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[0019] The invention discloses a method for manufacturing a PCB board with an inner layer of super-thick copper board. The specific implementation of the invention will be further described below in combination with preferred embodiments.
[0020] see attached figure 1 with figure 2 , figure 1 shows the cross-sectional structure of inner layer line etching, figure 2 The cross-sectional structure of the lamination process is shown.
[0021] Wherein, the ultra-thick copper plate 10 has an etching groove 11 , and the depth of the etching groove 11 is the general copper thickness of the ultra-thick copper plate 10 .
[0022] Wherein, one or more non-woven PP layers are arranged between adjacent ultra-thick copper plates 10 .
[0023] Preferably, the PCB manufacturing method with an inner layer ultra-thick copper plate comprises the following steps:
[0024] Step S1: Etching the inner layer core board and the ultra-thick copper board to form the inner layer circuit;
[0025...
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Abstract
The invention discloses a PCB production method adopting inner layer ultra-thick copper boards. The PCB production method comprises the steps of: S1: etching inner layer core veneers and the ultra-thick copper boards to form inner layer lines; S2: etching a non-line region of each ultra-thick copper board by half a copper thickness to form a groove; S3: placing one or a plurality of resin-containing non-woven fabric PP layers between the adjacent ultra-thick copper boards; and S4: carrying out lamination on each ultra-thick copper board and the non-woven fabric PP layers in the step S3 to obtain a target board body. According to the PCB production method adopting the inner layer ultra-thick copper boards, which is disclosed by the invention, the non-woven fabric PP layers are used for replacing conventional FR4 PP layers to carry out lamination and glue filling, and the etched grooves of the non-line regions of the ultra-thick copper boards do not need to be filled up by resin, so thatproduction flow is simplified and production cost is reduced.
Description
technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a method for manufacturing a PCB board with an inner-layer super-thick copper board. Background technique [0002] At present, the inner ultra-thick copper plate only etches half the copper thickness to form grooves in the non-circuit area. Next, it is generally necessary to fill up the etched non-circuit area (ie, the groove area) by filling resin before pressing. However, the above-mentioned conventional production methods have defects, which are mainly reflected in that the production process is relatively long, it is not easy to reduce the cost, and it increases the difficulty of process control. Contents of the invention [0003] Aiming at the state of the prior art, the present invention overcomes the above-mentioned defects, and provides a method for manufacturing a PCB board with an inner layer of super-thick copper board. [0004] The pre...
Claims
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IPC IPC(8): H05K3/00
CPCH05K3/00
Inventor 邱锡曼刘宝勇芦保民李志雄陈晓宁李兵李升强张志平白克容
Owner CHENGYI ELECTRONICS JIAXING