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Processing method of PCB and PCB

A processing method and technology of processing procedures, which are applied in the direction of coating non-metallic protective layer, secondary treatment of printed circuit, electrical components, etc., can solve the problem of high failure rate in solder resisting, so as to avoid ink falling off, improve bonding force, The effect of saving production cost

Inactive Publication Date: 2018-11-06
SHENZHEN WUZHU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a PCB processing method and PCB to solve the problem of high failure rate of the solder resist link in the prior art

Method used

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  • Processing method of PCB and PCB
  • Processing method of PCB and PCB

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Experimental program
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Embodiment 1

[0024] see figure 1 , figure 1 The process flow of the PCB processing method in the present embodiment 1 is shown, including the following steps:

[0025] S1, pre-coarsening treatment

[0026] In this roughening treatment step, the surface of the ceramic substrate is ground and polished by a ceramic grinder, so that the surface of the ceramic substrate is clean and smooth, so as to facilitate the subsequent roughening treatment process, so as to be the next step of the processing method Lay the groundwork.

[0027] S2, coarsening treatment

[0028] In this roughening treatment step, the clean and flat ceramic substrate obtained after step S1 is rinsed by high-pressure sandblasting, so that the ceramic substrate forms a clean and uneven rough surface, which is used in the PCB solder mask process. In the middle, a strong bonding force is formed between the solder resist ink and the ceramic substrate, thereby greatly improving the success rate of the solder resist process.

Embodiment 2

[0030] Based on the first embodiment, the second embodiment provides a PCB processing method.

[0031] see figure 2 , figure 2 The process flow of the PCB processing method in the second embodiment is shown, including the following steps:

[0032] S01, washing treatment

[0033] In this step, the method of spraying water directly on the ceramic substrate is used to remove the residual working fluid on the PCB after pre-treatment.

[0034] In order to avoid impurities remaining on the ceramic substrate, multi-stage water washing can be used to wash the ceramic substrate in multi-stage, so as to completely remove the impurities remaining on the ceramic substrate in the previous processing steps and lay the foundation for the subsequent solder mask process .

[0035] In addition, in this embodiment, the ceramic substrate can also be washed with water multiple times, so as to achieve the purpose of completely removing impurities.

[0036] S02, pickling treatment

[0037] I...

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Abstract

The invention discloses a processing method of a PCB (Printed Circuit Board) and the PCB. The processing method comprises a step of performing roughening processing on a ceramic substrate before a PCBsolder resist processing process. The processing method of the invention has the beneficial effects that: the roughening processing performed on a surface of the ceramic substrate improves a bindingforce between the ceramic substrate and solder resist ink, thereby solving the problem of high failure rate of a solder resist processing link, avoiding ink losing, foaming or PCB scrapping caused byfailed solder resisting, and further saving production cost.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a PCB processing method and the PCB. Background technique [0002] With the development of PCB to a higher degree of integration, the processing technology requirements of PCB are getting higher and higher. In order to ensure the quality of PCB, solder mask is particularly important in PCB processing technology. Solder mask is a kind of protective layer, which is coated on the circuit and substrate of PCB that do not need to be soldered. The purpose is to prevent circuit bridging during soldering, provide long-term electrical protection and chemical resistance, and form a beautiful " coat". [0003] However, in the existing technology, solder masking is one of the processes with the highest failure rate. Since solder masking is a post-process in the PCB manufacturing process, if there is a problem with the solder masking process, it wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/282
Inventor 吴华军邵勇蔡志浩梁高朱占值
Owner SHENZHEN WUZHU TECH