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LED module

A technology of LED modules and encapsulants, applied in lighting and heating equipment, semiconductor devices of light-emitting elements, transportation and packaging, etc., can solve the problems of expensive manufacturing of comparable LED light sources, and achieve good optical effects, low energy, and low cost. Effect

Active Publication Date: 2018-11-09
LUMILEDS HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, small pitches require additional effort to deal with attendant thermal issues and are associated with more complex electrical routing issues
Therefore, an LED light source with a small pitch is significantly more expensive to manufacture than a comparable LED light source with a large pitch

Method used

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Experimental program
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Embodiment Construction

[0032] figure 1 A first embodiment of an LED module 1 according to the invention is shown. The figure shows a container 12, which is used as a holding container during the manufacturing process. In this exemplary embodiment, container 12 has the shape of an elongated rectangle, with base 120 and side walls 121 defining light exit opening 122 . The figure shows a row of LEDs 10 mounted on a strip 13 (with the usual electrical connections) arranged along the base 120 of the container 12 . Container 12 has been filled with an encapsulant mixture comprising a translucent component and a metallic particle component (indicated in a greatly exaggerated manner by small triangle shapes; particle size is in the micron range). A suitable layer thickness may be about 6-7 mm. This mixture has been set or cured in the final stage of the manufacturing process to be used as an encapsulant 11 for the LED 10 .

[0033] figure 2 shows the disconnected figure 1 LED modules. Looking at the...

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Abstract

The invention describes an LED module (1) comprising a number of light- emitting diodes (10) arranged on a carrier (100); and a encapsulant (11) covering the LEDs (10), which encapsulant (11) comprises a translucent constituent (110) and a metallic particle constituent (111), and wherein the constituents (110, 111) of the encapsulant (11) are chosen to impart a desired degree of concealment to theLEDs (10) in the inactive state of the LED module (1). The invention further describes a device (2) comprising a device housing (20) and at least one such LED module (1) arranged to emit light through an aperture in the device housing (2), and wherein the constituents (110, 111, 112) of the encapsulant (11) of the LED modules (1) are chosen according to a colour of the device housing (20). The invention further describes a method of manufacturing such an LED module (1).

Description

technical field [0001] LED modules, devices including LED modules, and methods of manufacturing LED modules are described. Background technique [0002] Light emitting diodes (LEDs) are used in a wide variety of applications. In particular, high power LEDs are finding widespread use in retrofit lights; in automotive lighting modules such as daytime running lights, brake lights, and indicator lights; in smartphone flash units, and the like. In some LED lighting applications, the emitting surface of the semiconductor die can be seen when the device is severed. Typically, the die appears as a small yellowish square or rectangle due to the phosphor coating on the emitting surface. In some lighting applications, such as retrofit lights, where multiple LEDs are mounted around a rod insert that is visible through a glass bulb or plastic tube, the yellow square can be very conspicuous. Since a visible yellow die may be considered unattractive by the end user, some LED modules hav...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L25/075H01L33/54
CPCH01L25/0753H01L33/56H01L2933/005H01L2933/0091H01L33/483F21S4/28F21K9/66F21S41/28F21S41/141B60Q1/28B60Q2400/30F21K9/90H01L27/153
Inventor F.M.H.克龙普韦茨C.克莱吉嫩N.A.M.施韦格斯G.库姆斯
Owner LUMILEDS HLDG BV