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Silicon wafer shaping method and device

A shaping device and silicon wafer technology, applied in the field of solar photovoltaic, can solve the problems of easy fatigue of workers, high labor intensity, low efficiency of silicon wafers, etc.

Active Publication Date: 2021-04-20
WUXI LEAD INTELLIGENT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manual plastic surgery is labor-intensive, workers are prone to fatigue, and the efficiency and effect of silicon wafer plastic surgery are low

Method used

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  • Silicon wafer shaping method and device
  • Silicon wafer shaping method and device
  • Silicon wafer shaping method and device

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Embodiment Construction

[0028] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on The embodiments in the present invention and other embodiments obtained by persons of ordinary skill in the art without making creative efforts all belong to the protection scope of the present invention.

[0029] It should be noted that the terms used here are only used to describe specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that when the term "comprises" is used in this specification, it indicates the presence of features, steps, opera...

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Abstract

The invention discloses a silicon chip shaping method and device, wherein the shaping method includes: grabbing a stack of silicon chips, placing it vertically on a set position above a shaping platform; The wafers are loosened by a set distance, and the stack of silicon wafers is blown to loosen; the side edges of the stack of silicon wafers are clamped to an aligned state. The invention can automatically realize the shaping of silicon wafers, arrange and align the surrounding edges of a stack of silicon wafers, and facilitate subsequent plastic sealing and packaging of silicon wafers, thus avoiding protruding corners of silicon wafers caused by misalignment of silicon wafers Fragmentation or hidden cracking also avoids the silicon wafer size after plastic sealing being too large and difficult to fit into the foam box due to misalignment of the silicon wafers; the shaping method is simple and convenient, the shaping speed is fast, the efficiency is high, and the shaping effect is good.

Description

technical field [0001] The invention relates to a silicon wafer shaping method and device, belonging to the technical field of solar photovoltaics. Background technique [0002] In the solar photovoltaic industry, cell silicon wafers need to be packaged before leaving the factory. The existing packaging method of silicon wafers adopts a foam box to carry silicon wafers, wherein a stack of silicon wafers needs to be plastic-sealed first, and then the plastic-sealed silicon wafers are placed in the foam box. [0003] Before the silicon wafers are plastic-encapsulated, it is necessary to reshape a stack of silicon wafers so that the edges of the silicon wafers are aligned, so as to avoid chipping or cracking at the corners of the protruding silicon wafers due to misalignment of the silicon wafers. To avoid the oversized silicon wafer after molding due to the misalignment of the silicon wafer, which makes it difficult to fit into the foam box. [0004] Currently, the shaping o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B63/00
CPCB65B63/00
Inventor 不公告发明人
Owner WUXI LEAD INTELLIGENT EQUIP CO LTD
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