Plastic packaging method for LED light source

Abstract

The invention provides a plastic packaging method for an LED light source. The method comprises the steps as follows: a plastic packaging mold is provided, wherein the plastic packaging mold comprisesan upper mold and a lower mold corresponding to the upper mold; a pressing block is arranged at the lower end of the upper mold; and the pressing block can be heated. An LED light source module is put into a cavity of the lower mold; a film is put on the LED light source module; and the upper mold descends to a preset position of the lower mold to form a closed cavity. Vacuum pumping treatment iscarried out on the closed cavity through a first air-pumping hole in the upper mold and a second air-pumping hole in the pressing block; the pressing block is heated to melt the film; and solidifyingtreatment is finally carried out to obtain the plastic-packaged LED light source module. According to the plastic packaging method, a packaging technology of laying the film and heating the pressingblock in sequence and then applying a laminating process to the LED light source module is adopted, so that the LED light source module which is higher in reliability, smaller in thickness, lighter inweight, lower in cost and more flexible in applicability can be obtained; air bubbles in the colloid packaging process can be effectively avoided through packaging in a vacuum confined space; and thepackaging yield is improved.

Description

technical field [0001] The present application relates to the technical field of LED display, in particular to a plastic packaging method of an LED light source. Background technique [0002] With the continuous development of semiconductor lighting technology, LED application fields are also expanding. The packaging of the existing LED circuit boards mostly adopts a pre-packaged single LED light source, which is welded on the aluminum-based circuit board, and then fixed by extrusion sealing. This connection method leads to slower plastic sealing of the LED light source. If the extrusion nozzle is not properly operated, it will touch the light source, and the extrusion amount is not properly controlled, which will cause uneven sealing. Afterwards, it will affect the flatness of the LED light source module, thereby affecting the light output effect and increasing the failure rate and a series of problems. Contents of the invention [0003] The technical problem mainly sol...

AI Technical Summary

Problems solved by technology

This connection method leads to slower plastic sealing of the LED light source. If the extrusion nozzle is not properly operated, it will touch the light source, and the extrusion amount is not properly controlled, which will cause uneven sealing. Afterwards, it will affect the flatness of the LED light source module, thereby affecting the light output effect and increasing the failure rate, etc.

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