Laser processing device
A laser processing and laser technology, which is applied in the direction of laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as winding processing lines, and achieve the effect of preventing winding and reducing debris
Active Publication Date: 2021-06-22
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In addition, laser-excited plasma is different from granular solid fragments, and has an inherent refractive index. If the laser line passes through the laser-excited plasma, it cannot be focused to the desired interval, and the processing line may meander
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0022] Hereinafter, an embodiment of the laser processing apparatus 1 according to the present invention will be described with reference to the drawings. In the description of the embodiment, terms indicating directions (for example, "up and down", "left and right", "front and rear", and "X, Y, Z", etc.) are used appropriately for easy understanding, but this is for explanation. These terms do not limit the present invention. In addition, in each drawing, in order to clarify the shape or feature of each component of the laser processing apparatus 1, these dimensions are illustrated as relative dimensions, and are not necessarily shown on the same scale.
[0023] figure 1 It is a perspective view of the laser processing apparatus 1 which concerns on embodiment of this invention. The laser processing apparatus 1 according to the embodiment of the present invention is schematically equipped with a support base, a movement mechanism (both not shown) fixed to the support base, ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| length | aaaaa | aaaaa |
Login to View More
Abstract
The present invention provides a laser processing device capable of preventing meandering of a processing line by a laser beam and substantially reducing debris adhering to the periphery of a substrate and a processing chamber. The laser processing device is provided with: a stage holding a substrate and capable of moving in the -X direction; a laser source for processing the substrate by irradiating a laser beam to the substrate W held on the stage; and a dust suction duct disposed between the laser source and the carrier. Between the sets, including the first optical path extending from the first opening to the second opening along the -Z direction, the laser beam passes through the first optical path; and the dust suction pump, which is arranged on the downstream side of the dust suction pipe, at the X The direction draws the air in the suction duct. In addition, the dust suction duct has a pair of air deflectors facing each other in the Y direction. The distance between the pair of air guide plates is the narrowest in the optical path area sandwiching the first optical path, and the upstream and downstream areas of the optical path area follow each other. widens as it moves away from the optical path region.
Description
technical field [0001] The present invention relates to a laser processing device, and more particularly to a laser processing device for forming groove-shaped openings (streets) in divisional regions that divide functional device regions on a substrate to be processed by irradiating pulsed laser light. Background technique [0002] When the pulsed laser beam is irradiated along the grooves of the substrate to be processed such as silicon or sapphire, the components of the substrate to be processed such as silicon or sapphire are melted, and melted debris (fragments) are scattered or rebounded. The melted fragments are subjected to a laser line with high energy density, such as silicon atoms and electrons are ionized to form a plasma in which cations and electrons move separately. This kind of plasma is called laser-excited plasma. The shorter the wavelength of the laser line, the greater the initial velocity of the rebounding melted fragments, and the easier micronization. ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/142
CPCB23K26/142B23K26/364B23K2103/56
Inventor 唐崎秀彦佐伯英史
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD