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Array substrate, dispLay paneL and dispLay device

A technology for array substrates and display panels, applied in nonlinear optics, instruments, optics, etc., can solve problems affecting product quality, etc., and achieve the effect of improving flattening effect, improving product quality, and uniform film thickness

Pending Publication Date: 2018-11-23
XIAMEN TIANMA MICRO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide an array substrate, a display panel, and a display device to solve the problem in the prior art that the product quality is affected due to the level difference between the color resist layer and the source-drain layer

Method used

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  • Array substrate, dispLay paneL and dispLay device
  • Array substrate, dispLay paneL and dispLay device
  • Array substrate, dispLay paneL and dispLay device

Examples

Experimental program
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Effect test

Embodiment 1

[0032] In specific implementation, in the embodiment of the present invention, such as image 3 As shown, the array substrate may include: a target film layer 300 located between the base substrate 100 and the color resist layer 112 . Wherein, the target film layer 300 has a recessed structure 200; the recessed structure 200 penetrates the target film layer 300, that is, the recessed structure 200 may be a via hole. In this way, a recessed structure penetrating through the target film layer is provided in the target film layer to fill the recessed structure with the color resist layer, thereby reducing the level difference between the color resist layer and the source-drain layer.

[0033] Generally, for the array substrate, there are generally multiple film layers of one whole layer disposed thereon. The recessed structure provided on the array substrate can be formed by simultaneously removing multiple film layers located in the pixel opening area in the array substrate, or c...

Embodiment 2

[0040] In specific implementation, in the embodiment of the present invention, such as Figure 5 As shown, the array substrate may include: a target film layer 300 located between the base substrate 100 and the color resist layer 112 . Wherein, the target film layer 300 has a recessed structure 200; the thickness of the target film layer 300 in the area where the recessed structure 200 is located is smaller than the thickness of the target film layer 300 in other areas. In this way, the recessed structure is formed by thinning the target film layer, so as to fill the recessed structure with the color resist layer, thereby reducing the level difference between the color resist layer and the source-drain layer.

[0041] Generally, for the array substrate, there are generally multiple film layers of one whole layer disposed thereon. The concave structure provided on the array substrate can be formed by simultaneously thinning the multi-layer film layers located in the pixel open...

Embodiment 3

[0048] Of course, the base substrate can also be thinned to form a recessed structure. In specific implementation, such as Figure 8 and Figure 9 As shown, the base substrate 100 has a first surface S1 facing the color resist layer 112, and the first surface S1 has a recessed structure 200; the thickness of the base substrate 100 in the area where the recessed structure 200 is located is smaller than the thickness of the base substrate 100 in other areas . In this way, when the base substrate 100 is thinned to form a concave structure, and then other film layers are sequentially arranged on the base substrate 100, such as the interlayer dielectric layer 140, the gate insulating layer 130, and the buffer layer 160, due to the formation of the same film layer The thicknesses are generally the same, and finally a recessed structure can be formed in the opening area of ​​the pixel unit, so that the color resist layer can be directly filled in the recessed structure, thereby red...

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Abstract

The invention discLoses an array substrate, a dispLay paneL and a dispLay device. Concave structures are arranged in aLL pixeL opening regions, the concave structures are arranged between a substratebody and a coLor ring resistance Layer, the orthographic projections of the concave structures on the substrate body overLap the orthographic projections of the pixeL opening regions where the concavestructures are Located on the substrate body so as to fiLL the concave structures with the coLor ring resistance Layer, and the segment difference between the coLor ring resistance Layer and a sourcedrain eLectrode Layer is reduced, so that after a fLattening Layer is prepared on the coLor ring resistance Layer, the fiLm thickness of the fLattening Layer is more uniform, the fLattening effect ofthe fLattening Layer is improved, the production quaLity can be improved, and the process preparing difficuLty can be reduced.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate, a display panel and a display device. Background technique [0002] In the existing display device technology, the display panel may include a liquid crystal display panel (Liquid Crystal Display, LCD) and an organic light emitting display panel (Organic Light Emitting Diode, OLED). Among them, the LCD forms an electric field capable of controlling the deflection of liquid crystal molecules by applying a voltage on the pixel electrode and the common electrode, and then controls the transmission of light to realize the display function of the display panel. The OLED display panel uses organic electroluminescent materials. When a current passes through the organic electroluminescent materials, the luminescent materials will emit light, thereby realizing the display function of the display panel. [0003] With the development of display technology, curv...

Claims

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Application Information

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IPC IPC(8): G02F1/1362G02F1/1368G02F1/1335
CPCG02F1/133514G02F1/136209G02F1/1368G02F1/136222
Inventor 贝亮亮陈国照
Owner XIAMEN TIANMA MICRO ELECTRONICS
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