Integrated antenna package structure and terminal

Abstract

An embodiment of the invention discloses an integrated antenna package structure, which comprises a first substrate and a second substrate, wherein a first patch antenna is arranged on a first surfaceof the first substrate, the second substrate is connected to one side of a second surface of the first substrate, the second substrate is provided with a third surface and fourth surface which are opposite, the second surface is provided with a second patch antenna, a projection of the second patch antenna on the first surface is at least partially overlapped with the first patch antenna, a cavity is formed between the first and second substrates, the second patch antenna is separated from the second surface through the cavity, and the fourth surface is provided with a radio frequency component which is used for transmitting and receiving a radio frequency signal through the first patch antenna and the second patch antenna. The integrated antenna package structure has the advantages of low cost and large bandwidth.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to an integrated antenna packaging structure and a terminal with the integrated antenna packaging structure. Background technique [0002] With the advent of the era of high-speed communication such as 5G and VR, the application and design of millimeter-wave antennas are increasing. Because the wavelength of the millimeter-wave frequency band is extremely small, the sensitivity to processing errors is very high. If the manufacturing accuracy is not good , the frequency cannot be matched, and the traditional PCB processing technology can no longer meet the requirements of millimeter wave processing accuracy, so high-precision technology is used to manufacture and design millimeter wave antennas. antenna integration technology). [0003] At present, AIP antennas in the industry are researching on using Silicon, Ceramic, BT substrate, and other materials. No matter what method is u...

AI Technical Summary

Problems solved by technology

[0002] With the advent of the era of high-speed communication such as 5G and VR, the application and design of millimeter-wave antennas are increasing. Because the wavelength of the millimeter-wave frequency band is extremely small, the sensitivity to processing errors is very high. If the manufacturing accuracy is not good , the frequency cannot be matched, and the traditional PCB processing technology can no longer meet the requirements of millimeter wave processing accuracy, so high-precision technology is used to manufacture and design millimeter wave antennas. Antenna Integration Technology)

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