Electronic assembly and glasses

A technology of electronic components and glasses, which is applied in the direction of electrical components, glasses/goggles, non-optical components, etc., can solve the problems of limited space for electronic equipment, increase in volume, and difficulty in meeting the requirements of thinner and lighter electronic equipment, and achieve the advantages of light and thin The effect of optimizing and improving space utilization

Pending Publication Date: 2018-11-23
SHENZHEN VOXTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the space of the electronic equipment itself is limited. If a variety of different circuit structures are arranged in the electronic equipment, it will undoubtedly require the electronic equipment to increase its own volume to meet the demand, so it is difficult to meet the requirements of thinner and thinner electronic equipment.

Method used

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  • Electronic assembly and glasses
  • Electronic assembly and glasses
  • Electronic assembly and glasses

Examples

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Embodiment Construction

[0025] Please also refer to Figure 1 to Figure 3 , figure 1 It is an exploded structure diagram of an embodiment of the electronic component of the present application, figure 2 is a partial cross-sectional view of an embodiment of the electronic component of the present application, image 3 yes figure 2 Enlarged view of part A in Fig.

[0026] The electronic components in this application can be applied to electronic equipment, where the electronic equipment can be any electronic equipment that needs to seal the internal structure, such as mobile phones, tablet computers, glasses with circuit components, electronic devices, etc., which will not be described in detail here limited.

[0027] Specifically, the electronic component includes an accommodating body 11 and a cover 12 . Wherein, the accommodating body 11 is provided with a cavity 111 having at least one opening 112 , and the cover 12 covers the opening 112 of the cavity 111 and is used to seal the cavity 111 ...

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Abstract

The present application discloses an electronic assembly and glasses. The electronic assembly comprises an accommodating body, a cover body, a first circuit board and a second circuit board; an open cavity is defined in the accommodating body; the opening of the cavity is covered with the cover body; the first circuit board is disposed in the cavity in a manner that the first circuit board is parallel to the opening plane of the opening; the surface of one side of the first circuit board is provided with a first microphone component, wherein the one side of the first circuit board faces the cover body; the second circuit board is arranged in the cavity in a manner that the second circuit board is perpendicular to the first circuit board; the surface of one side of the second circuit boardis provided with a second microphone component, wherein the one side of the second circuit board faces the side wall of the accommodating body; a hole sound guiding hole and a second sound guiding hole are formed in the side walls of the cover body and the accommodating body respectively; the first microphone component is used for receiving sound inputted through the first sound guiding hole; andthe second microphone component is used for receiving sound inputted through the second sound guiding hole. With the above technical schemes of the invention adopted, the space of the electronic assembly can be fully utilized. When the electronic assembly is applied to an electronic device, the lightening and thining of the electronic device can be benefitted.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to an electronic component and glasses. Background technique [0002] With the development of science and technology, people have higher and higher requirements on the versatility of electronic devices and the like. Therefore, different circuit structures need to be provided in the electronic device to meet the corresponding functional requirements. [0003] However, the space of the electronic device itself is limited. If a variety of different circuit structures are arranged in the electronic device, it will undoubtedly increase the size of the electronic device itself to meet the demand, and thus it is difficult to meet the requirement of thinning the electronic device. Contents of the invention [0004] The technical problem mainly solved by this application is to provide an electronic component and glasses, which can make full use of the space of the e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/08G02C11/00
CPCH04R1/08G02C11/10G02C11/06G02C5/143G02C5/20G02C5/22H04R5/033H04R3/005H04R1/406H04R1/04H04R2460/13H04R1/028H04R2201/107H04R1/083H04R1/46
Inventor 刘银超王跃强李永坚陈云斌张浩锋
Owner SHENZHEN VOXTECH CO LTD
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