A method of manufacturing a pcb

A production method and substrate technology, which is applied in the directions of multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problem of the inability to realize the mounting of components with special-shaped structures, the inability to realize the special assembly requirements of components at the same time, and the first step Solve problems such as single groove shape, achieve the effect of convenient combination mounting, saving installation space, and reducing assembly volume

Active Publication Date: 2020-07-24
DONGGUAN SHENGYI ELECTRONICS
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1) The shape of the first-order stepped groove is single, and it is impossible to mount components with special-shaped structures;
[0005] 2) A single metallized or non-metallized stepped groove cannot meet the special assembly requirements of components at the same time, or integrate other more power amplifier devices

Method used

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  • A method of manufacturing a pcb
  • A method of manufacturing a pcb
  • A method of manufacturing a pcb

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Embodiment Construction

[0041] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only the parts related to the present invention are shown in the drawings but not all of them.

[0042] Such as figure 1 Shown, a kind of manufacturing method of PCB comprises the following steps:

[0043] Step 1. Provide the upper substrate 1 with the first through groove 4, the middle substrate 2 and the lower substrate 3 with the second through groove 5, and brown the upper substrate 1, the middle substrate 2 and the lower substrate 3 .

[0044] Specifically, the upper substrate 1, the middle substrate 2 and the lower substrate 3 are subjected to browning treatment, so...

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Abstract

The invention relates to the technical field of circuit board production, and discloses a PCB manufacturing method. The method comprises the steps of: S1, providing an upper substrate with a first through groove opened, a middle substrate with a second through groove opened and a lower substrate, and sequentially stacking the upper substrate, the middle substrate and the lower substrate so that the second through groove of the middle substrate is located below the first through groove of the upper substrate; S2, filling the glue blocking material in the first through groove and the second through groove, and pressing the upper substrate, the middle substrate and the lower substrate to form a multilayer board; S3, taking out the glue blocking material, and forming a step groove by the firstthrough groove and the second through groove; S4, carrying out copper deposition and electroplating on the groove wall of the step groove, and metalizing the groove wall of the step groove; and S5, opening a third through groove on the bottom of the groove of the step groove. According to the PCB manufacturing method of the invention, the mounting of the special-shaped component and different sizes of component are realized by forming a step groove with multiple layers of steps on the PCB, thereby reducing the occupied space of the PCB.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a PCB. Background technique [0002] Printed circuit board (PCB for short) is the provider of electrical connection for electronic components. Before the appearance of printed circuit boards, the interconnection between electronic components relied on the direct connection of wires to form a complete circuit. In contemporary times, circuit panels only exist as effective experimental tools, and printed circuit boards have occupied an absolute dominant position in the electronics industry. [0003] In order to meet the high-density mounting or crimping requirements of printed circuit boards, multi-layer printed circuit boards are designed to open stepped grooves to reduce the assembly volume. The current stepped groove design mostly shows first-order metallization or non-metallization Step slots are used in microwave radio frequency pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4697H05K2201/09845
Inventor 纪成光王洪府赵刚俊焦其正
Owner DONGGUAN SHENGYI ELECTRONICS
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