Production process of printed circuit boards, electronic equipment and printed circuit boards
A technology for printed circuit boards and production processes, which is applied to the formation of printed circuit components, electrical connection of printed components, and removal of conductive materials by chemical/electrolytic methods, which can solve the problem of poor parameter indicators such as impedance, insertion loss, and return loss. , can not meet the high-speed signal system link design requirements and other problems, to achieve the effect of improving the S parameter index and improving the impedance
Active Publication Date: 2019-09-13
XINHUASAN INFORMATION TECH CO LTD
View PDF9 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
With the continuous development of high-speed signal design and the further increase of signal rate, the existing printed circuit board design schemes have poor parameters such as impedance, insertion loss, and return loss, which can no longer meet the requirements of high-speed signal system links. Design requirements
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0032] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The embodiment of the invention provides a printed circuit board, electronic equipment and a production technology of the printed circuit board, and relates to the field of electronic equipment. The printed circuit board comprises a board body, wherein the board body comprises a surface layer, a signal layer and a solder pad; the surface layer is arranged at one side of the signal layer, and the solder pad is arranged on the surface layer; a signal through hole is formed in the board body and penetrates through the surface layer and the signal layer; the signal layer is provided with a first reverse solder pad area corresponding to the solder pad, and a second reverse solder pad area corresponding to the signal through hole; the first reverse solder pad area is communicated with the secondreverse solder pad area. The printed circuit board, the electronic equipment and the production technology of the printed circuit board have the advantage that the printed circuit board can effectively improve the parameter indexes of impedance, insertion loss, echo loss and the like, so as to further improve the S parameter index of whole high-speed link.
Description
technical field [0001] The invention relates to the field of electronic equipment, in particular to a printed circuit board, electronic equipment and a production process for the printed circuit board. Background technique [0002] The printed circuit board (PCB) design of rectangular Surface Mounted Devices (SMD) pads defined by traditional high-speed differential signals does not involve insertion loss (Insertion Loss, IL), return loss (Return Loss, RL), Time Domain Reflectometer (Time Domain Reflectometer, TDR) and other design parameters require that the routing of rectangular SMD pads (such as copper skin hollowing out, layer-changing vias, etc.) is very arbitrary. With the continuous development of high-speed signal design and the further increase of signal rate, the existing printed circuit board design schemes have poor parameters such as impedance, insertion loss, and return loss, which can no longer meet the requirements of high-speed signal system links. Design r...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/06H05K3/42
Inventor 岳利李孝群
Owner XINHUASAN INFORMATION TECH CO LTD