Preparation method of insulating and heat-dissipating ink and insulating and heat-dissipating shielding cover
A technology of ink and thermally conductive filler, applied in ink, household appliances, applications, etc., can solve the problems of stable work affecting electronic products, temperature rise of electronic components, heat concentration of electronic products, etc., to achieve production efficiency and high yield , The effect of improving the yield rate and excellent insulation and heat dissipation performance
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Embodiment 1
[0046] An insulating and heat-dissipating ink, comprising the following raw materials in parts by weight: 48 parts of polyperfluoroethylene propylene, 36 parts of polyoxymethylene, 30 parts of epoxy resin, 50 parts of AlN thermal conductive filler, 4 parts of methyl silicone oil leveling agent, organic bentonite contact 4.5 parts of thickening agent, 8 parts of toluenesulfonic acid curing crosslinking catalyst, 15 parts of 3-glycidyloxypropyltrimethoxysilane coupling agent, 34 parts of cyclohexanone solvent, and 15 parts of pigment and filler.
[0047] Among them, the particle size of the heat-conducting filler is 8 μm; the viscosity of the insulating and heat-dissipating ink is 200 dPa·s.
[0048] A method for preparing an insulating and heat-dissipating shield cover. Using the above-mentioned insulating and heat-dissipating ink, a screen printing method is used to print an insulating and heat-dissipating ink pattern on a metal strip 1 for making an insulating and heat-dissipa...
Embodiment 2
[0056] An insulating and heat-dissipating ink, comprising the following raw materials in parts by weight: 54 parts of polyperfluoroethylene propylene, 43 parts of polyoxymethylene, 37.5 parts of epoxy resin, Al 2 o 3 55 parts of thermally conductive filler, 6 parts of 1080 leveling agent, 7 parts of attapulgite thixotropic thickener, 10 parts of boron trifluoride curing crosslinking catalyst, 22.5 parts of γ-aminopropyltriethoxysilane coupling agent, 51 parts of butanol solvent, 20 parts of pigments and fillers.
[0057] Among them, the particle size of the thermally conductive filler is 9 μm; the viscosity of the insulating and heat-dissipating ink is 250 dPa·s.
[0058] A method for preparing an insulating and heat-dissipating shield. The method for preparing the insulating and heat-dissipating shield in this embodiment is the same as the method for preparing the insulating and heat-dissipating shield in Example 1.
Embodiment 3
[0060] An insulating and heat-dissipating ink, comprising the following raw materials in parts by weight: 60 parts of polyperfluoroethylene propylene, 50 parts of polyoxymethylene, 45 parts of epoxy resin, 60 parts of SiC thermally conductive filler, 8 parts of 1074 leveling agent, diatomite thixotropic 9 parts of thickener, 12 parts of dicyandiamide curing cross-linking catalyst, 30 parts of anilinomethyltriethoxysilane coupling agent, 68 parts of toluene solvent, 25 parts of pigment and filler.
[0061] Wherein, the particle size of the thermally conductive filler is 10 μm; the viscosity of the insulating and heat-dissipating ink is 300 dPa·s.
[0062] A method for preparing an insulating and heat-dissipating shield. The method for preparing the insulating and heat-dissipating shield in this embodiment is the same as the method for preparing the insulating and heat-dissipating shield in Example 1.
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