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Preparation method of insulating and heat-dissipating ink and insulating and heat-dissipating shielding cover

A technology of ink and thermally conductive filler, applied in ink, household appliances, applications, etc., can solve the problems of stable work affecting electronic products, temperature rise of electronic components, heat concentration of electronic products, etc., to achieve production efficiency and high yield , The effect of improving the yield rate and excellent insulation and heat dissipation performance

Active Publication Date: 2021-04-16
GUANGDONG HERUN PRECISION METAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The material of the shielding cover is generally made of 0.2mm thick stainless steel and nickel-nickel copper. Among them, nickel-nickel copper is not only a metal shielding material that is easy to tin, but also has a certain degree of conductivity. The shielding cover made of nickel-nickel copper may be incompatible with Electronic components or PCB boards are electrically connected, causing electronic components to be disconnected or circuit boards to be short-circuited, affecting the normal and stable operation of electronic products
At the same time, the components of electronic products will generate heat when they are working. When the heat inside the electronic product cannot be diffused to the outside of the electronic product in time through the shielding cover, it may cause the internal heat concentration of the electronic product, which will increase the temperature of the electronic component and cause a crash or The problem of burning components

Method used

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  • Preparation method of insulating and heat-dissipating ink and insulating and heat-dissipating shielding cover
  • Preparation method of insulating and heat-dissipating ink and insulating and heat-dissipating shielding cover

Examples

Experimental program
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Effect test

Embodiment 1

[0046] An insulating and heat-dissipating ink, comprising the following raw materials in parts by weight: 48 parts of polyperfluoroethylene propylene, 36 parts of polyoxymethylene, 30 parts of epoxy resin, 50 parts of AlN thermal conductive filler, 4 parts of methyl silicone oil leveling agent, organic bentonite contact 4.5 parts of thickening agent, 8 parts of toluenesulfonic acid curing crosslinking catalyst, 15 parts of 3-glycidyloxypropyltrimethoxysilane coupling agent, 34 parts of cyclohexanone solvent, and 15 parts of pigment and filler.

[0047] Among them, the particle size of the heat-conducting filler is 8 μm; the viscosity of the insulating and heat-dissipating ink is 200 dPa·s.

[0048] A method for preparing an insulating and heat-dissipating shield cover. Using the above-mentioned insulating and heat-dissipating ink, a screen printing method is used to print an insulating and heat-dissipating ink pattern on a metal strip 1 for making an insulating and heat-dissipa...

Embodiment 2

[0056] An insulating and heat-dissipating ink, comprising the following raw materials in parts by weight: 54 parts of polyperfluoroethylene propylene, 43 parts of polyoxymethylene, 37.5 parts of epoxy resin, Al 2 o 3 55 parts of thermally conductive filler, 6 parts of 1080 leveling agent, 7 parts of attapulgite thixotropic thickener, 10 parts of boron trifluoride curing crosslinking catalyst, 22.5 parts of γ-aminopropyltriethoxysilane coupling agent, 51 parts of butanol solvent, 20 parts of pigments and fillers.

[0057] Among them, the particle size of the thermally conductive filler is 9 μm; the viscosity of the insulating and heat-dissipating ink is 250 dPa·s.

[0058] A method for preparing an insulating and heat-dissipating shield. The method for preparing the insulating and heat-dissipating shield in this embodiment is the same as the method for preparing the insulating and heat-dissipating shield in Example 1.

Embodiment 3

[0060] An insulating and heat-dissipating ink, comprising the following raw materials in parts by weight: 60 parts of polyperfluoroethylene propylene, 50 parts of polyoxymethylene, 45 parts of epoxy resin, 60 parts of SiC thermally conductive filler, 8 parts of 1074 leveling agent, diatomite thixotropic 9 parts of thickener, 12 parts of dicyandiamide curing cross-linking catalyst, 30 parts of anilinomethyltriethoxysilane coupling agent, 68 parts of toluene solvent, 25 parts of pigment and filler.

[0061] Wherein, the particle size of the thermally conductive filler is 10 μm; the viscosity of the insulating and heat-dissipating ink is 300 dPa·s.

[0062] A method for preparing an insulating and heat-dissipating shield. The method for preparing the insulating and heat-dissipating shield in this embodiment is the same as the method for preparing the insulating and heat-dissipating shield in Example 1.

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Abstract

The invention relates to the technical field of insulating and heat-dissipating materials, in particular to a method for preparing an insulating and heat-dissipating ink and an insulating and heat-dissipating shield cover, wherein the insulating and heat-dissipating ink includes the following raw materials in parts by weight: 48-60 parts of polyperfluoroethylene propylene, 36-60 parts of polyoxymethylene 50 parts, epoxy resin 30‑45 parts, thermal conductive filler 50‑60 parts, leveling agent 4‑8 parts, thixotropic thickener 4.5‑9 parts, curing crosslinking catalyst 8‑12 parts, coupling agent 15‑ 30 parts, 34-68 parts of solvent, 15-25 parts of pigment and filler, with high thermal conductivity and excellent dielectric properties, thermal stability, toughness and aging resistance.

Description

technical field [0001] The invention relates to the technical field of insulating and heat-dissipating materials, in particular to a preparation method of an insulating and heat-dissipating ink and an insulating and heat-dissipating shield cover. Background technique [0002] The shielding cover is a tool used to shield the influence of external electromagnetic waves on the internal circuit and the external radiation of electromagnetic waves generated inside. It is mainly used in mobile phones, GPS and other fields. The material of the shielding cover is generally made of 0.2mm thick stainless steel and nickel-nickel copper. Among them, nickel-nickel copper is not only a metal shielding material that is easy to tin, but also has a certain degree of conductivity. The shielding cover made of nickel-nickel copper may be incompatible with Electronic components or PCB boards are electrically connected, resulting in open circuit of electronic components or short circuit of circuit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/106C09D11/103C09D11/102C09D11/03
CPCC09D11/03C09D11/102C09D11/103C09D11/106
Inventor 刘声金
Owner GUANGDONG HERUN PRECISION METAL MATERIALS CO LTD