Compression die
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NO 59 RES INST OF CHINA ORDNANCE IND
- Publication Date
- 2018-12-07
Smart Images

Figure 1 
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Abstract
Description
technical field
[0001] The invention relates to a pressing die. Background technique
[0002] Blind hole components with local thick walls are generally used such as Figure 1a The forming method of positive extrusion upsetting. In this method, the punch is an integral structure. After the punch and the blank start to contact, the metal at the head flows faster than the metal at the bottom. When the downward position of the punch reaches At the step position of the die, the metal in the thick-walled part of the billet will flow upwards and leave the step of the die. As the punch continues to descend, when the metal in the thick-walled part of the billet contacts the stepped surface of the punch, the metal in the thick-walled part will start to flow back down again. , it is easy to produce defects such as folding at the stepped part in contact with the die, and it is very difficult to unload the billet from the slender rod of the punch after the extrusion is completed. [00...