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Texturing cutting device for producing monocrystalline silicon pieces

A monocrystalline silicon wafer and cutting device technology, which is applied in the field of texturing and cutting devices for producing monocrystalline silicon wafers, can solve the problems of reduced work efficiency, low work efficiency, and high labor intensity, and achieve improved work efficiency and low manufacturing costs , the effect of reducing labor intensity

Inactive Publication Date: 2018-12-07
浙江贝盛新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing monocrystalline silicon wafer cutting device mainly uses a plurality of ultra-fine diamond wires arranged in parallel to move back and forth to complete the cutting of the monocrystalline silicon segment. Once one of the ultra-fine diamond wires breaks, the entire cutting device needs to be stopped. , the replacement of the diamond wire not only reduces the work efficiency, but generally after the cutting is completed, the workers need to send the cut monocrystalline silicon wafer to the texturing device to make texturing on the cutting surface, so as to reduce the damage of the cutting surface and labor High strength; at the same time, before using multiple ultra-fine diamond wires for cutting, it is necessary to adjust the tension of each ultra-fine diamond wire and the parallelism between the two ultra-fine diamond wires, which is inconvenient to use
Therefore, the existing monocrystalline silicon wafer cutting device has the problems of low work efficiency, high labor intensity and inconvenient use.

Method used

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  • Texturing cutting device for producing monocrystalline silicon pieces
  • Texturing cutting device for producing monocrystalline silicon pieces
  • Texturing cutting device for producing monocrystalline silicon pieces

Examples

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Embodiment Construction

[0018] The present invention will be further described below in conjunction with the accompanying drawings and embodiments, but not as a basis for limiting the present invention.

[0019] Example. A texturing and cutting device for the production of monocrystalline silicon wafers, consisting of Figures 1 to 6 As shown, including a frame 1, two electric slide rails 2 arranged symmetrically to each other are arranged on the frame 1, and a plurality of evenly distributed storage frames 3 are arranged between the two electric slide rails 2; One side is provided with mobile platform 4, is connected with the first hydraulic cylinder 5 on mobile platform 4; Shock absorber 6 is installed on the top surface of mobile platform 4, and high speed motor 7 is installed on shock absorber 6; There is a rotating shaft 8, a cleaning liquid inlet pipe 9 is installed on the rotating shaft 8, and a texturing liquid inlet pipe 10 is arranged on one side of the cleaning liquid inlet pipe 9; a plur...

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Abstract

The invention discloses a texturing cutting device for producing monocrystalline silicon pieces. The texturing cutting device comprises a rack (1), wherein an electric slide rail (2), a storage frame(3) and a mobile platform (4) are arranged on the rack (1); a first hydraulic cylinder (5), a damping table (6), a high-speed motor (7) and a rotary shaft (8) are connected on the mobile platform (4);a cleanout liquid inlet tube (9), a texturing liquid inlet tube (10) and a diamond saw blade (11) are mounted on the rotary shaft (8); a diamond line (12), a cleanout liquid channel (14) and a texturing liquid channel (15) are arranged on the diamond saw blade (11); an automatic steering collecting device (29) is connected on the electric slide rail (2); a first inductor (16) and a second inductor (17) are arranged on the mobile platform (4); and an infrared detecting device (42) is arranged on the electric slide rail (2). The texturing cutting device can improve working efficiency and cutting precision, and further has the advantages of being relative low in manufacturing cost, convenient to use, high in safety and convenient to collect.

Description

technical field [0001] The invention relates to a single crystal silicon cutting device, in particular to a texturing cutting device for producing single crystal silicon slices. Background technique [0002] The existing monocrystalline silicon wafer cutting device mainly uses a plurality of ultra-fine diamond wires arranged in parallel to move back and forth to complete the cutting of the monocrystalline silicon segment. Once one of the ultra-fine diamond wires breaks, the entire cutting device needs to be stopped. , the replacement of the diamond wire not only reduces the work efficiency, but generally after the cutting is completed, the workers need to send the cut monocrystalline silicon wafer to the texturing device to make texturing on the cutting surface, so as to reduce the damage of the cutting surface and labor High strength; at the same time, before using multiple ultra-fine diamond wires for cutting, it is necessary to adjust the tension of each ultra-fine diamon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/02B28D5/04B28D7/04C30B33/10
CPCB28D5/0064B28D5/0082B28D5/02B28D5/045C30B33/10
Inventor 邱小永
Owner 浙江贝盛新材料科技有限公司
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