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A kind of preparation method and product of thermal interface material

An interface material and heat-conducting layer technology, which is used in heat exchange materials, flat products, chemical instruments and methods, etc., can solve the problem of not completely wrapping the heat-conducting channel of the glass fiber reinforced layer, affecting the combination of the heat-conducting sheet and the glass-fiber reinforced layer, and the thermal conductivity. The coefficient is only 0.3W, etc., to achieve the effect of portability, small equipment space, and minimization

Active Publication Date: 2020-12-25
德阳中碳新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When preparing the heat conduction sheet, the glass fiber reinforced layer arranged on the side of the heat conduction layer will become a layer of heat insulation layer, which will seriously affect the formation of the heat conduction network
Moreover, due to poor fluidity, the mixed semi-solid product cannot be completely rolled to the other side of the glass fiber reinforced layer during rolling, and the semi-solid product cannot completely wrap the glass fiber reinforced layer and form a better heat conduction channel
Only the silica gel matrix material can be rolled on the other side of the glass fiber reinforced layer to form a layer of silica gel layer with only silica gel matrix material, which leads to the thermal conductivity of silica gel being only 0.3W / MK, which seriously affects the actual thermal conductivity of the heat conduction sheet
In addition, due to the delamination between the silica gel matrix material and the solid high thermal conductivity particles in the silica gel matrix material during calendering, it will also affect the bonding between the thermal conductive sheet and the glass fiber reinforced layer, resulting in separation and unstable bonding The phenomenon

Method used

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  • A kind of preparation method and product of thermal interface material
  • A kind of preparation method and product of thermal interface material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This embodiment provides a method for preparing a thermal interface material, including the following steps:

[0039] (1) Distributed vacuuming

[0040] Add liquid silica gel, coupling agent, heat-conducting powder, flame retardant, inhibitor and platinum catalyst to the dispersing equipment to disperse and vacuumize to obtain a heat-conducting mixture after dispersing evenly. Among them, the mass parts of each component are: 15-30 parts of liquid silica gel, 0.3-0.6 parts of coupling agent, 20-60 parts of 45-micron particle size thermal conductive powder, 40-80 parts of 15-micron particle size thermal conductive powder, 5 50-100 parts of thermal conductive powder with micron particle size, 15-25 parts of flame retardant, 0.04-0.06 parts of inhibitor, 0.08-1.1 parts of platinum catalyst; the thermal conductive powder is alumina, and the flame retardant is aluminum hydroxide.

[0041] In this step, in order to disperse all the raw materials better and faster, the disper...

Embodiment 2

[0065] This embodiment provides a method for preparing a thermal interface material, including the following steps:

[0066] (1) Distributed vacuuming

[0067] Add liquid silica gel, coupling agent, heat-conducting powder, flame retardant, inhibitor and platinum catalyst to the dispersing equipment to disperse and vacuumize to obtain a heat-conducting mixture after dispersing evenly. Among them, the mass parts of each component are: 15 parts of liquid silica gel, 0.3 parts of coupling agent, 20 parts of 45 micron particle size thermal conductive powder, 40 parts of 15 micron particle size thermal conductive powder, 50 parts of 5 micron particle size thermal conductive powder, 15 parts of flame retardant, 0.04 part of inhibitor, 0.08 part of platinum catalyst; aluminum oxide is used as thermal conductive powder, and aluminum hydroxide is used as flame retardant.

[0068] In this step, in order to disperse all the raw materials better and faster, the dispersion and vacuuming in...

Embodiment 3

[0079] This embodiment provides a method for preparing a thermal interface material, including the following steps:

[0080] (1) Distributed vacuuming

[0081] Add liquid silica gel, coupling agent, heat-conducting powder, flame retardant, inhibitor and platinum catalyst to the dispersing equipment to disperse and vacuumize to obtain a heat-conducting mixture after dispersing evenly. Among them, the mass parts of each component are: 30 parts of liquid silica gel, 0.6 parts of coupling agent, 60 parts of 45 micron particle size thermal conductive powder, 80 parts of 15 micron particle size thermal conductive powder, 100 parts of 5 micron particle size thermal conductive powder, 25 parts of flame retardant, 0.06 parts of inhibitor, 1.1 parts of platinum catalyst; aluminum oxide as thermal conductive powder, aluminum hydroxide as flame retardant.

[0082] In this step, in order to disperse all the raw materials better and faster, the dispersion and vacuuming include the followin...

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Abstract

The invention discloses a heat conduction interface material and a preparation method thereof. The preparation method comprises the following steps: (1) dispersion and vacuumizing: adding liquid silica gel, a coupling agent, heat conduction powder, a flame retardant, an inhibitor and a platinum catalyst into dispersion equipment, carrying out dispersion and vacuumizing, and carrying out uniform dispersion, so as to obtain a heat conduction mixture; (2) calendering solidification: respectively extruding the heat conduction mixture to two surfaces of glass fiber cloth by virtue of calendering equipment so as to form a heat conduction layer, dragging the heat conduction layer into a drying oven through a release film, and carrying out solidification; and (3) gum film lamination: uniformly coating the surface of the solidified heat conduction layer with heat conduction glue, so as to form an adhesive layer, and laminating the adhesive layer with the release film, so as to obtain the heat conduction interface material. The heat conduction interface material provided by the invention has high viscosity and strength and an excellent heat conduction effect.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a method for preparing a heat-conducting interface material and a product thereof. Background technique [0002] With the development of industrial production and science and technology, people continue to put forward new requirements for materials. In the field of electronic appliances, due to the rapid development of integration technology and assembly technology, electronic components and logic circuits are developing in the direction of lightness, thinness and smallness, and the heat generation is also increasing. Therefore, insulating materials with high thermal conductivity are required for effective removal. The heat generated by electronic equipment, so as to achieve the purpose of improving product quality and service life. [0003] At present, because the thermal interface material can fill the gap, complete the heat transfer between the heat-generati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/29C09J183/07C09J11/08C09J11/04C08L83/04C08K3/22C09K5/14B29D7/00B29B7/00B29C35/02
CPCB29B7/002B29C35/02B29D7/00C08K3/22C08K2003/2227C08K2201/003C08K2201/014C08L2201/02C08L2205/025C08L2205/03C09J11/04C09J11/08C09J183/04C09J2483/00C09J2483/006C09K5/14C09J7/29C09J2301/122C09J2301/124C09J2301/312C09J2301/408C09J2301/41C08L83/04
Inventor 刘明春刘怡刘步云秦忠夏传军
Owner 德阳中碳新材料科技有限公司
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