Heat conduction interface material and preparation method thereof

Abstract

The invention discloses a heat conduction interface material and a preparation method thereof. The preparation method comprises the following steps: (1) dispersion and vacuumizing: adding liquid silica gel, a coupling agent, heat conduction powder, a flame retardant, an inhibitor and a platinum catalyst into dispersion equipment, carrying out dispersion and vacuumizing, and carrying out uniform dispersion, so as to obtain a heat conduction mixture; (2) calendering solidification: respectively extruding the heat conduction mixture to two surfaces of glass fiber cloth by virtue of calendering equipment so as to form a heat conduction layer, dragging the heat conduction layer into a drying oven through a release film, and carrying out solidification; and (3) gum film lamination: uniformly coating the surface of the solidified heat conduction layer with heat conduction glue, so as to form an adhesive layer, and laminating the adhesive layer with the release film, so as to obtain the heat conduction interface material. The heat conduction interface material provided by the invention has high viscosity and strength and an excellent heat conduction effect.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a method for preparing a heat-conducting interface material and a product thereof. Background technique [0002] With the development of industrial production and science and technology, people continue to put forward new requirements for materials. In the field of electronic appliances, due to the rapid development of integration technology and assembly technology, electronic components and logic circuits are developing in the direction of lightness, thinness and smallness, and the heat generation is also increasing. Therefore, insulating materials with high thermal conductivity are required for effective removal. The heat generated by electronic equipment, so as to achieve the purpose of improving product quality and service life. [0003] At present, because the thermal interface material can fill the gap, complete the heat transfer between the heat-generati...

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Problems solved by technology

When preparing the heat conduction sheet, the glass fiber reinforced layer arranged on the side of the heat conduction layer will become a layer of heat insulation layer, which will seriously affect the formation of the heat conduction network

Moreover, due to poor fluidity, the mixed semi-solid product cannot be completely rolled to the other side of the glass fiber reinforced layer during rolling, and the semi-solid product cannot completely wrap the glass fiber reinforced layer and form a better heat conduction channel

Only the silica gel matrix material can be rolled on the other side of the glass fiber reinforced layer to form a layer of silica gel layer with only silica gel matrix material, which leads to the thermal conductivity of silica gel being only 0.3W / MK, which seriously affects the actual thermal conductivity of the heat conduction sheet

In addition, due to the delamination between the silica gel matrix material and the solid high thermal conductivity particles in the silica gel matrix material during calendering, it will also affect the bonding between the thermal conductive sheet and the glass fiber reinforced layer, resulting in separation and unstable bonding The phenomenon

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