Workpiece surface-mounting device and method applying chip supply mechanism

Abstract

The invention provides a workpiece surface-mounting device and method applying a chip supply mechanism. The device comprises a substrate bearing mechanism, a chip supply mechanism, and a chip bondingmechanism; the substrate bearing mechanism fixes a substrate and drives the substrate to move on a first plane parallel to the surface of the substrate, the movement stroke of the substrate on the first plane being not smaller than the size of the substrate on the first plane; the chip supply mechanism acquires chips from the chip transfer position of the workpiece surface-mounting device, fixes the chips, and transfers the chips to the chip supply position; the chip bonding mechanism picks up the chips at the chip supply position, and mounts the chips on the predetermined surface-mounting positions of the substrate at a surface-mounting work area position; the chip supply mechanism includes a first transport mechanism, a first transport track, a second transport mechanism, and a second transport track, wherein the first transport track and the second transport track are located between the chip transfer position and the chip supply position, the first transport mechanism and the second transport mechanism reciprocate along the first transport track and the second transport track, and alternately acquires the chips from the chip transfer position and provides the chips at the chipsupply position.

Description

technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a workpiece mounting device and method with a chip supply mechanism. Background technique [0002] With the continuous development of modern information technology, integrated circuit chips are increasingly developing in the direction of high density and high performance. Chips manufactured using traditional packaging and interconnection technologies such as TO, DIP, PLCC, and QFP have been difficult to meet the increasing performance requirements of chips. Therefore, semiconductor packaging and assembly technologies such as flip-chip, fan-out packaging, and three-dimensional packaging Integrated advanced packaging technology emerged as the times require to reduce device package size, increase interconnection density, improve integrated circuit chip performance, and reduce product prices. [0003] In the existing advanced packaging technology, semiconducto...

AI Technical Summary

Problems solved by technology

Since the chip supply mechanism is at the front end of the chip bonding mechanism, the contradiction between a single transmission mechanism and a long running distance affects the efficiency of the entire chip placement process

[0005] Therefore, in order to improv

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