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A processing method for improving burr forming of a polytetrafluoroethylene printed circuit board

A printed circuit board, polytetrafluoroethylene technology, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of high input cost, low production efficiency, soft texture, etc., and achieve reduced input cost and production efficiency. High, improve the effect of forming burr

Inactive Publication Date: 2018-12-11
JIAN MANKUN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The conventional processing method of PTFE printed circuit board is to use a gong machine to cut and shape it with a milling cutter, but its texture is relatively soft, and a large number of burrs are prone to occur on the cut surface, which affects product reliability.
In recent years, some enterprises have used laser cutting for laser forming. Although it can ensure a smooth cut surface without burrs, the investment cost of this method is very high, and only one piece of PTFE printing with a thickness less than or equal to 2 mm is allowed to be processed at a time. circuit boards, low production efficiency, only suitable for small batch production

Method used

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  • A processing method for improving burr forming of a polytetrafluoroethylene printed circuit board
  • A processing method for improving burr forming of a polytetrafluoroethylene printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] First, take 18 pieces of polytetrafluoroethylene printed circuit boards, among which, the diameter of the positioning hole of the polytetrafluoroethylene printed circuit board is 3.0mm, the size of the polytetrafluoroethylene printed circuit board is 450*550mm, and the thickness is 2mm ;Take 6 pieces of the first phenolic backing plate and the second phenolic backing plate with a size of 450*550mm and 24 pieces of kraft paper; secondly, import the corresponding gong belt into the gong machine system, and drill several holes on the gong electromechanical board. 2.9mm positioning hole; implant a pin with a diameter of 2.95mm into the positioning hole; again, use a gong machine to drill the phenolic backing plate and kraft paper according to the forming positioning hole pattern of the PTFE printed circuit board, and the hole diameter is 3.0mm; put the first phenolic backing plate 2 on the bakelite board 1 that has been implanted with pins 6 as required; stack a piece of kra...

Embodiment 2

[0032] First, take 12 pieces of polytetrafluoroethylene printed circuit boards, wherein the diameter of the positioning hole of the polytetrafluoroethylene printed circuit board is 3.0mm, the size of the polytetrafluoroethylene printed circuit board is 450*550mm, and the thickness is 1.9 mm; take the first phenolic backing board and the second phenolic backing board with a size of 550*550mm, 6 pieces and 36 kraft paper; secondly, import the corresponding gong belt into the gong machine system, and drill several holes on the gong electromechanical board The positioning hole is 2.95mm; insert a pin with a diameter of 3.0mm into the positioning hole; again, use a gong machine to drill the phenolic backing plate and kraft paper according to the pattern of the positioning hole formed on the PTFE printed circuit board. is 3.05mm; the first phenolic backing plate 8 is set on the bakelite board 7 that has been implanted with pins 12 as required; a piece of kraft paper 9 is stacked on t...

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Abstract

The invention is applicable to the technical field of circuit board processing, and provides a processing method for improving the burr forming of a polytetrafluoroethylene printed circuit board. Themethod comprises the following steps: drilling the first phenolic backing plate, the second phenolic backing plate and a plurality of kraft papers through a gong machine according to the forming positioning holes of the polytetrafluoroethylene printed circuit board; The first phenolic backing plate, the polytetrafluoroethylene printed circuit board and the second phenolic backing plate are successively sleeved on a bakelite board which has been pre-implanted with pins according to requirements; The first phenolic cushion plate, the polytetrafluoroethylene printed circuit board and the second phenolic cushion plate are spaced apart by kraft paper, and are cut by a main shaft clamping milling cutter of a gong machine, and the processing speed is set to 0.2 m / min - 0.4 m / min; It can effectively improve the forming burr of PTFE printed circuit board, and can realize the simultaneous machining of 12-18 PTFE printed circuit boards, the production efficiency is high and the cost of input is reduced substantially.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, in particular to a processing method for improving the forming burr of a polytetrafluoroethylene printed circuit board. [0002] Background technique [0003] As a kind of high-frequency microwave printed circuit board, polytetrafluoroethylene printed circuit board can be used for high speed, low loss, low delay, high insulation due to the low dielectric constant and low dielectric loss of the substrate material used. Really signaling. [0004] The conventional processing method of PTFE printed circuit board is to use a gong machine to cut and shape it with a milling cutter, but its texture is soft, and a large number of burrs are prone to occur on the cut surface, which affects product reliability. In recent years, some enterprises have used laser cutting for laser forming. Although it can ensure a smooth cut surface without burrs, the investment cost of this method is very...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0044H05K3/0047
Inventor 王小亮张孝斌肖学慧周立荣
Owner JIAN MANKUN TECH
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