Electroplated diamond wire saw

A technology for electroplating diamond and diamond, applied in the field of abrasives, can solve the problem that electroplating diamond wire saw cannot take into account the service life and cutting efficiency, etc., and achieves the effect of facilitating the sanding process, improving self-sharpening and cutting efficiency.

Active Publication Date: 2018-12-18
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide an electroplated diamond wire saw, so as to solve the prob

Method used

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  • Electroplated diamond wire saw
  • Electroplated diamond wire saw

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Embodiment 1

[0030] The electroplated diamond wire saw of the present embodiment, the structure diagram is as follows figure 1 As shown, it includes a base line 4 , a pre-plated metal layer 3 and a thickened metal layer 2 arranged on the base line from inside to outside in sequence, and the thickened metal layer is embedded with diamond abrasive grains 1 . Schematic diagram of the structure of diamond abrasive grains figure 2 As shown, it includes a diamond inner core 5 and a corroded carbide layer 6 with uneven surface coated on the outside of the diamond inner core 5 .

[0031] The diamond abrasive grains of the present embodiment are prepared in the following steps:

[0032] 1) Place the diamond micropowder with a particle size of 8 / 12 μm in alcohol, dry it after ultrasonic cleaning, and dry the diamond micropowder and silver-copper-titanium alloy powder (composition of Ag 72wt%, Cu 25wt%, Ti 3wt%) , particle size is 3 / 5 μ m) according to the mass ratio of 1:2 mixed evenly, to obtain...

Embodiment 2

[0038] The electroplated diamond wire saw of this embodiment has the same structure as that of Embodiment 1, and the diamond abrasive grains used are prepared by the following steps:

[0039] 1) Place the diamond micropowder with a particle size of 6 / 8 μm in alcohol, dry it after ultrasonic cleaning, and dry the diamond micropowder and nickel-chromium-phosphorus alloy powder (composition is Ni76wt%, Cr14wt%, P10wt%, particle size is 1 / 3 μm) and mixed uniformly according to the mass ratio of 1:1.5 to obtain the mixture A;

[0040] 2) Under a protective atmosphere, the mixture A was heated up to 930°C and kept for 20s to obtain the mixture B;

[0041]3) Sieve the mixture B, use the difference in particle size to remove unreacted nickel-chromium-phosphorus alloy powder, and sort out the corroded diamond powder; place the corroded diamond powder in alcohol for ultrasonic treatment (10KHz, 10min), remove the surface attachment, and obtain the diamond micropowder covered with carbi...

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Abstract

The invention relates to an electroplated diamond wire saw. The electroplated diamond wire saw comprises a base line, an electroplated layer and diamond abrasive particles embedded in the electroplated layer, wherein the preparation of the diamond abrasive particles comprises the following steps that (1) diamond micropowder and alloy powder are uniformly mixed to obtain mixed powder; thermochemical corrosion is carried out on the mixed powder under vacuum or protective atmosphere at a chemical reaction temperature to obtain corroded diamond micropowder; the alloy powder contains metal elementswhich can react with C to form corresponding metal carbides at the chemical reaction temperature; and (2) the corroded diamond micropowder is treated with strong acid fluid. According to the electroplated diamond wire saw, through the design of the diamond abrasive particles, the holding strength of abrasive materials is improved; the particle size of the abrasive particles is increased to facilitate the sanding process and reduces the difficulty of the plating process; and the self-sharpening property of the diamond micropowder is improved, and the balance between the service life and cutting efficiency of the electroplated diamond wire saw is realized.

Description

technical field [0001] The invention belongs to the field of abrasive abrasives, and in particular relates to an electroplated diamond wire saw. Background technique [0002] Compared with the traditional free abrasive cutting process, the electroplated diamond wire saw cutting process has many advantages such as environmental protection and high efficiency. At present, electroplated diamond wire saws are more and more widely used in the field of cutting and processing of hard and brittle materials such as ceramics, stone, glass, monocrystalline silicon, gemstones, and crystals. [0003] Electroplated diamond wire saws are usually composed of a baseline, an electroplated metal layer electroplated on the baseline, and diamond abrasive grains embedded in the electroplated metal layer. The preparation process is generally: baseline pretreatment → pre-plating → sanding → thickening → post-processing. The electroplating process is to use the metal ions in the electroplating sol...

Claims

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Application Information

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IPC IPC(8): B28D5/04C01B32/28C25D15/00C25D7/06
CPCB28D5/04C25D7/0607C25D15/00C01B32/28
Inventor 邢波赵延军闫宁祝小威张林州
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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