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A semiconductor device and process for cleaning a wafer surface by atomization method

A semiconductor and wafer technology, applied in the field of semiconductor manufacturing, can solve problems such as increased investment, environmental pollution, and frequent cleaning

Active Publication Date: 2018-12-18
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high number of cleanings not only consumes a lot of chemicals and deionized high-purity water, it is obvious that the investment in this area will continue to increase
On the other hand, the various chemicals used in the cleaning solution will seriously pollute the environment if they are not handled properly

Method used

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  • A semiconductor device and process for cleaning a wafer surface by atomization method
  • A semiconductor device and process for cleaning a wafer surface by atomization method
  • A semiconductor device and process for cleaning a wafer surface by atomization method

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Embodiment Construction

[0037] In the following description, the present invention is described with reference to various examples. One skilled in the art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of embodiments of the invention. However, the invention may be practiced without these specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0038] In this specification, reference to "one embodiment" or "the...

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PUM

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Abstract

The invention discloses a semiconductor device for cleaning a wafer surface by an atomization method, comprising a liquid storage cup, wherein the liquid storage cup is used for collecting cleaning waste liquid; a top cover including a neck portion and an opening portion, the neck portion being located at the upper part of the top cover, the neck portion having a diameter smaller than the openingportion, the opening portion covering the liquid storage cup, and the top cover and the liquid storage cup forming a cleaning chamber; An atomizer, wherein the atomizer is a hollow cylinder, the top end of the atomizer is sealed, the bottom end of the atomizer is fixedly communicated with the neck of the top cover, the side surface of the hollow cylinder is provided with one or more first throughholes, and the cleaning liquid enters the cleaning chamber through the first through holes; And a storage liquid supply system comprising a plurality of tanks, each tank storing a liquid for a different wet process, each tank being connected to the atomizer through a pipe and a plurality of three-way valves, and supplying liquid to the atomizer according to the requirements of a particular wet process.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular, the invention relates to a semiconductor device and process for cleaning the surface of a wafer by an atomization method. Background technique [0002] With the development of miniaturization, integration and intelligence of modern electronic products, the complexity and integration density of IC chips, the core components, are getting higher and higher, and the corresponding cleaning technology is also complicated. [0003] In the manufacturing process of semiconductor devices and integrated circuits, in order to ensure that the surface of the wafer is always in a clean state, almost every process involves cleaning, and the higher the integration of integrated circuits, the more manufacturing processes, the required cleaning process There are more and more craft methods. The high number of cleanings not only consumes a lot of chemicals and deionized high-purity water, i...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02057H01L21/67017
Inventor 姚大平刘海燕
Owner NAT CENT FOR ADVANCED PACKAGING