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Detection machine and detection method

A testing machine and machine technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as poor performance of testing machines, and achieve the effects of increasing productivity, performance, and scan rate.

Inactive Publication Date: 2018-12-21
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the performance of existing testing machines is poor

Method used

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  • Detection machine and detection method

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Embodiment Construction

[0022] As mentioned in the background art, the performance of the testing machine in the prior art is relatively poor.

[0023] A detection machine, comprising: a detection cavity; a chuck fixed in the detection cavity, the chuck is suitable for fixing a wafer; a probe located in the detection cavity, and the probe is located in the chuck above, the probe is adapted to scan the wafer.

[0024] During the scanning of the wafer by the probe, the movement of the probe is driven by a motor. However, due to the limitation of the driving capability of the motor itself, the speed at which the motor drives the probe is limited, so the speed at which the probe scans the wafer is limited.

[0025] Usually, when the precision of the probe scanning the wafer is low, the motor is adjusted to the maximum driving capacity, so that the probe scans the wafer at the limit speed that the probe can reach, however, despite such an operation, the motor's The limit rate will still limit the furthe...

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Abstract

A detection machine and a detection method are provided, wherein the detection machine comprises a detection chamber; a chuck positioned in the detection chambery, the chuck being adapted to fix the wafer; a probe positioned in the detection cavity and positioned above the chuck, the probe adapted to scan a wafer; During the scanning of the probe, the direction in which the probe moves is parallelto and opposite to the direction in which the chuck moves. The performance of the detection machine is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a detection machine and a detection method. Background technique [0002] In the field of semiconductor manufacturing, the manufacture of semiconductor devices requires multiple processes. Usually, after each process is completed, semiconductor devices need to be inspected, such as defect inspection. [0003] When testing a semiconductor device, the semiconductor device needs to be placed in a testing machine, and the testing machine has a probe, and the semiconductor device is tested by scanning the probe above the semiconductor device. [0004] However, the performance of existing testing machines is poor. Contents of the invention [0005] The problem to be solved by the present invention is to provide a detection machine and a detection method to improve the performance of the detection machine. [0006] In order to solve the above problems, the present inventi...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67242H01L21/683
Inventor 董健黄仁德刘命江
Owner HUAIAN IMAGING DEVICE MFGR CORP