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Transportation device for system integrated chip

A transportation device and system integration technology, applied in the direction of transportation and packaging, manual conveying devices, packaging, etc., can solve the problems of system integration chip damage, reduce the service life of system integration chips, and cannot transport system integration chips, so as to enhance practicability Effect

Inactive Publication Date: 2018-12-28
芜湖广智天和信息技术有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a transportation device for system integrated chips, which solves the problem of damage to the system integrated chips without the shock absorption function and reduces the service life of the system integrated chips, which has limitations and cannot be used for different specifications The problem of shipping system integrated chips

Method used

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  • Transportation device for system integrated chip
  • Transportation device for system integrated chip
  • Transportation device for system integrated chip

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] Such as Figure 1-3 As shown, the present invention provides a technical solution: a transport device for system integrated chips, comprising a transport box 1, the inner wall of the transport box 1 is provided with a first chute 2, and the inner wall of the first chute 2 is slidably connected with a placement plate 3. The bottom of the placement plate 3 is fixedly connected with the first wedge-shaped block 4, and the inner bottom wall of the transport...

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Abstract

The invention discloses a transportation device for a system integrated chip. The transportation device for the system integrated chip comprises a transportation box, a first sliding groove is formedin the inner wall of the transportation box, a placing plate is slidably connected to the inner wall of the first sliding groove, a first wedge-shaped block is fixedly connected to the bottom of the placing plate, a second sliding groove is fixedly formed in the inner bottom wall of the transportation box, a sliding block is connected to the inner wall of the second sliding groove in a sliding mode, the top of the sliding block is fixedly connected with a second wedge-shaped block, one side of the second wedge-shaped block is fixedly connected with a first spring, one end of the first spring is fixedly connected with the inner wall of the transportation box. According to the transportation device for the system integrated chip, a first wedge-shaped block, a second sliding groove, a slidingblock, a second wedge-shaped block, a first spring, a clamping groove, a second spring, a moving block and a clamping strip are arranged, the problem that a system integrated chip is damaged due to the fact that a damping function is not provided is solved, the service life of the system integrated chip is reduced, the system and the method have the limitation and can not be transported accordingto the different specifications of the system integrated chip.

Description

technical field [0001] The invention relates to the technical field of system integration chips, in particular to a transportation device for system integration chips. Background technique [0002] The computer integrated manufacturing system is produced with the development of computer aided design and manufacturing. It is based on information technology, automation technology and manufacturing, organically integrates various isolated automation subsystems scattered in the product design and manufacturing process through computer technology, and forms a system suitable for multi-variety and small-batch production to achieve overall benefits. Integrated and intelligent manufacturing system. At present, my country's CIMS has been changed to "modern integrated manufacturing and modern integrated manufacturing system". It has expanded the connotation of the original CIM / CIMS in breadth and depth. Among them, "modern" means computerization, informationization, and intelligenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G7/02B65D81/02B65D25/10B65D85/30
CPCB65D25/101B65D81/02B65D85/30B65G7/02B65G2201/02B65G2207/40
Inventor 陈兆康彭申海
Owner 芜湖广智天和信息技术有限公司
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