Novel P-N-Si synergistic flame retardant epoxy resin curing agent and preparation method thereof

An epoxy resin curing and synergistic flame retardant technology, which is applied in chemical instruments and methods, organic chemistry, compounds of group 5/15 elements of the periodic table, etc., can solve problems such as fire hazards and restrictions, and achieve the goal of not being easy to migrate and penetrate The effect of low output, low performance and excellent flame retardancy

Active Publication Date: 2018-12-28
WUHAN INSTITUTE OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the limiting oxygen index (LOI) of epoxy resin is only 19.8%, which is easy to cause fire and is restricted in many special fields.

Method used

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  • Novel P-N-Si synergistic flame retardant epoxy resin curing agent and preparation method thereof
  • Novel P-N-Si synergistic flame retardant epoxy resin curing agent and preparation method thereof
  • Novel P-N-Si synergistic flame retardant epoxy resin curing agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A novel P-N-Si synergistic flame retardant epoxy resin curing agent, its molecular structure is as follows:

[0032]

[0033] Above-mentioned compound synthesis method, the steps are as follows:

[0034] 1. Under an inert gas atmosphere, add p-aminophenol and dioxane to a device equipped with a dropping funnel, agitator, and condensation reflux. After the p-aminophenol is completely dissolved, add dichlorodimethylsilane dropwise , Reacted at 80°C for 10h to obtain an intermediate product.

[0035] 2. Under an inert gas atmosphere, mix the intermediate product, DOPO and N’N-dimethylformamide, and react at 140°C for 16 hours. After the reaction is completed, the final product is obtained after cooling, suction filtration, and recrystallization.

[0036] figure 1 For the novel P-N-Si synergy flame-retardant epoxy resin curing agent prepared by example 1 of the present invention 1 H-NMR spectrum. The analysis is shown in Table 1, and the formation of the product can ...

Embodiment 2

[0040] A novel P-N-Si synergistic flame retardant epoxy resin curing agent, its synthetic method is as follows:

[0041] 1. Under an inert gas atmosphere, add p-aminophenol and dioxane to a device equipped with a dropping funnel, agitator, and condensation reflux. After the p-aminophenol is completely dissolved, add dichlorodimethylsilane dropwise , reacted at 90°C for 9h, after the reaction was completed, an intermediate product was obtained.

[0042] 2. Under an inert gas atmosphere, mix the intermediate product, DOPO and N’N-dimethylformamide, and react at 130°C for 16 hours. After the reaction is completed, the final product is obtained after cooling, suction filtration, and recrystallization.

Embodiment 3

[0044] A novel P-N-Si synergistic flame retardant epoxy resin curing agent, its synthetic method is as follows:

[0045] 1. Under an inert gas atmosphere, add p-aminophenol and dioxane to a device equipped with a dropping funnel, agitator, and condensation reflux. After the p-aminophenol is completely dissolved, add dichlorodimethylsilane dropwise , Reacted at 100°C for 8h to obtain an intermediate product.

[0046] 2. Under an inert gas atmosphere, mix the intermediate product, DOPO and N’N-dimethylformamide, and react at 140°C for 18 hours. After the reaction, the final product is obtained after cooling, suction filtration, and recrystallization.

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Abstract

The invention discloses a novel P-N-Si synergistic flame retardant epoxy resin curing agent with a molecular structure in the description below. The novel P-N-Si synergistic flame retardant epoxy resin curing agent includes 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), dichlorodimethylsilane and p-aminophenol. The preparation process of a flame retardant is divided into two steps, first an intermediate product is obtained by reacting dichlorodimethylsilane with p-aminophenol, and then the intermediate product and the DOPO react to obtain a final product. The molecular structure contains three elements, P, N and Si, which greatly improves the flame retardant properties of an epoxy resin after curing.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin materials, and in particular relates to a novel P-N-Si synergistic flame-retardant epoxy resin curing agent and a preparation method thereof. Background technique [0002] Epoxy resin has excellent mechanical properties, chemical corrosion resistance, electrical insulation, processing performance, and adhesive performance. At the same time, due to the low volatility of epoxy resin during curing, no small molecules are formed, so that its shrinkage is low, and it can be used in coatings. , Adhesives, printed circuit boards, electronic packaging materials, composite materials, aerospace and automotive and other fields are widely used. However, the limiting oxygen index (LOI) of epoxy resin is only 19.8%, which is easy to cause fire and is restricted in many special fields. [0003] Flame retardants can be divided into halogen-containing flame retardants and halogen-free flame retardants accordi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50C07F9/6574
CPCC07F9/657163C08G59/504
Inventor 彭永利卓念万春杰熊丽君
Owner WUHAN INSTITUTE OF TECHNOLOGY
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