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Thin film transistor and its manufacturing method

A technology of thin film transistors and amorphous silicon layers, which is applied in the direction of transistors, semiconductor/solid-state device manufacturing, semiconductor devices, etc., and can solve problems such as instability of hydrogenated amorphous silicon layers

Active Publication Date: 2021-04-23
HKC CORP LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a thin film transistor and a preparation method thereof for the problem of instability of the hydrogenated amorphous silicon layer in the amorphous silicon thin film transistor

Method used

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  • Thin film transistor and its manufacturing method
  • Thin film transistor and its manufacturing method
  • Thin film transistor and its manufacturing method

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Embodiment Construction

[0038] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0039] It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected t...

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Abstract

The invention relates to a method for preparing a thin film transistor, the method comprising: sequentially forming a gate and a gate insulating layer on the gate on a substrate; depositing a gate insulating layer at a first rate on the gate insulating layer The first hydrogenated amorphous silicon layer, the Si-H bond content in the first hydrogenated amorphous silicon layer is 25% to 97%; the second hydrogenated amorphous silicon layer is deposited at a second rate on the first hydrogenated amorphous silicon layer. In the amorphous silicon layer, the Si-H bond content in the second hydrogenated amorphous silicon layer is 45% to 99%, the second rate is greater than the first rate, and the thickness of the second hydrogenated amorphous silicon layer is less than the thickness of the first hydrogenated amorphous silicon layer. In this application, the first hydrogenated amorphous silicon layer and the second hydrogenated amorphous silicon layer are used at the same time, which can reduce the total content of Si-H bonds, ensure production efficiency, improve performance and take into account production capacity.

Description

technical field [0001] The invention relates to the display field, in particular to a thin film transistor and a preparation method thereof. Background technique [0002] With the development of technology in recent years, thin film transistor displays have gradually occupied a dominant position in the display field due to their low power consumption and excellent display picture quality. Generally, thin film transistor displays use amorphous silicon thin film transistors as switches. Amorphous silicon thin film transistors usually have the properties of large area uniformity, large capacity, and high display quality, and are key devices for large-scale active liquid crystal display devices. [0003] However, the hydrogenated amorphous silicon layer in the amorphous silicon thin film transistor is unstable, and it absorbs more energy when illuminated, and generates more electron-hole pairs than when it is not illuminated, which will cause a threshold voltage shift and cause...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/336H01L29/786H01L29/06H01L29/10
CPCH01L29/0684H01L29/1033H01L29/66765H01L29/78669
Inventor 莫琼花卓恩宗
Owner HKC CORP LTD
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