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Wafer Film Removal and Cleaning Device and Cleaning Method of Wafer Horizontal Transport

A horizontal conveying and membrane cleaning technology, applied in the electronic field, can solve the problems of rising wafer production costs, reduce production costs, reduce equipment purchase and maintenance costs, and improve the yield rate

Active Publication Date: 2021-04-30
ANHUI HONGSHI AUTOMATION EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, industries such as PCB printed circuit boards and display panels have already introduced the film-removing cleaning equipment of the horizontal conveying type of leaves early. For the bath-type film removal and cleaning process machine, it has the advantages of low cost and high production capacity. The wafer industry needs to increase a lot of The purpose of cleaning the tank to achieve high productivity, but this method will lead to a substantial increase in wafer production costs in the wafer production industry. imminent

Method used

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  • Wafer Film Removal and Cleaning Device and Cleaning Method of Wafer Horizontal Transport
  • Wafer Film Removal and Cleaning Device and Cleaning Method of Wafer Horizontal Transport
  • Wafer Film Removal and Cleaning Device and Cleaning Method of Wafer Horizontal Transport

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Embodiment Construction

[0024] like Figure 1-6 As shown, the wafer removal cleaning device and its cleaning method of the wafer horizontal conveyance type include: a base bracket 1, a raw material box 2, a transmission mechanism 3, a first cleaning tank 4, a second cleaning tank 5, and a third cleaning tank 7. The fourth cleaning tank 8, the base 6 and the control buttons, the first cleaning tank 4, the second cleaning tank 5, the third cleaning tank 7, and the fourth cleaning tank 8 are arranged on the base, and the first cleaning tank 4 is located on the second The rear end of the cleaning tank 5, the second cleaning tank 5 is located at the rear end of the third cleaning tank 7, the third cleaning tank 7 is located at the rear end of the fourth cleaning tank 8, the transmission mechanism 3 is fixed on the upper end of the base 6 through a bracket, and the lower end of the base 6 is provided with The base bracket 1 and the raw material box 2 are arranged on one side of the upper end surface of the...

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Abstract

The invention discloses a film-removing cleaning device and cleaning method for wafers of a horizontal conveying type. The device comprises: a base bracket, a raw material box, a transmission mechanism, a first cleaning tank, a second cleaning tank, a third cleaning tank, Four cleaning tanks, a base and control buttons, the first cleaning tank, the second cleaning tank, the third cleaning tank, and the fourth cleaning tank are arranged on the base, the first cleaning tank is located at the rear end of the second cleaning tank, and the second cleaning tank The tank is located at the rear end of the third cleaning tank, and the third cleaning tank is located at the rear end of the fourth cleaning tank. The transmission mechanism is fixed on the upper end of the base through a bracket. The button is arranged on one side of the upper end face of the base. The invention has large production capacity, high efficiency of stand-alone production, reduces enterprise equipment purchase and maintenance costs, and utilizes the horizontal conveying mode of leaves to avoid excessive contact between the wafer and the cleaning liquid, which causes the cleaning liquid to corrode it, and improves the product yield. .

Description

technical field [0001] The invention belongs to the field of electronics, and relates to semiconductor wet process equipment technology, in particular to a wafer-removing and cleaning device and a cleaning method thereof of a leaf level conveying type. Background technique [0002] At present, the immersion bath type film removal and cleaning process machine has been maturely developed in the wafer industry. However, industries such as PCB printed circuit boards and display panels have already introduced the film-removing cleaning equipment of the horizontal conveying type of leaves early. For the bath-type film removal and cleaning process machine, it has the advantages of low cost and high production capacity. The wafer industry needs to increase a lot of The purpose of cleaning the tank to achieve high productivity, but this method will lead to a substantial increase in wafer production costs in the wafer production industry. Emergence is imminent. Contents of the inv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02041H01L21/67057
Inventor 简健哲陈滢如
Owner ANHUI HONGSHI AUTOMATION EQUIP CO LTD