A double wafer flip chip package structure

Abstract

Based on the flip-chip packaging structure, the invention provides a double wafer flip chip package structure, which is characterized in that the substrate is a substrate with two wafer slots, the substrate is provided with a central separator, the substrate slot has a certain slope, and a plurality of hemispherical grooves are arranged at the contacts of the slot ramps and the chip conductive bumps; the chip has a plurality of cylindrical conductive bumps, and the top of the conductive bumps is hemispherical. An upper heat sink is connected with the top of the substrate. The advantages of thedouble wafer flip chip package structure are: chip soldering self-alignment, double-wafer integrated package, high integration level, chip package area reduction and enhanced heat dissipation function.

Description

technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a double-chip flip-chip packaging structure. Background technique [0002] Flip Chip Interconnect Technology (Flip Chip Interconnect Technology), also known as "inverted chip packaging" or "inverted chip packaging method", is a kind of chip packaging technology. This packaging technology is to arrange the conductive bumps on the active surface of the chip, and flip chip bonding on the substrate, so that the chip can be electrically connected to the substrate through the conductive bumps, and electrically connected to the outside through the internal circuit of the substrate. electronic device. Flip-chip bonding technology is suitable for high-pin-count chip packaging structures, and has the advantages of reducing chip packaging area and shortening signal transmission paths. Flip-chip bonding technology has been widely used in the field of chip packaging. ...

AI Technical Summary

Problems solved by technology

The current stackable flip crystal has been proposed, but this structure has many disadvantages, which is not conducive to heat dissipation, the consumption of materials has not been reduced, and the cost is also high

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