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Electronic assembly welding method for automatic elevated wave soldering of components

A technology of wave soldering and soldering method, which is applied in the direction of assembling printed circuits with electrical components, welding equipment, metal processing equipment, etc. Unreasonable and other problems, to achieve the effect of improving work efficiency, improving service reliability, and preventing inconsistency in height.

Inactive Publication Date: 2018-12-28
SHANGHAI AEROSPACE EQUIP MFG GENERAL FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manually raising components is not only inefficient, but also easily leads to inconsistent and unreasonable lifting heights on both sides of components, thereby reducing the reliability of printed circuit board assemblies

Method used

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  • Electronic assembly welding method for automatic elevated wave soldering of components
  • Electronic assembly welding method for automatic elevated wave soldering of components
  • Electronic assembly welding method for automatic elevated wave soldering of components

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Embodiment Construction

[0022] The following will combine Figure 1 ~ Figure 4 A further detailed description will be made on the electronic assembly welding method of the automatic lifting wave soldering of components of the present invention.

[0023] The electronic assembly and welding method for components with automatic lifting wave soldering of the present invention is suitable for the electronic assembly process that requires lifting components, and the components are mostly through-hole plug-in components, such as plug-in diodes , Plug-in resistors, plug-in relays, etc.

[0024] The electronic assembly and welding method for automatically raising wave soldering of components in a preferred embodiment of the present invention includes the following steps:

[0025] 1) Production preparation

[0026] Carry out visual quality inspection of components, and check the type, specification, model and quantity of components. The appearance and quality of components should be intact, with clear marki...

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Abstract

An electronic assembly welding method for automatic elevated wave soldering of components is provided. The method comprises the steps of: adopting a mounting machine to mount a lifting cushion strip at the insertion position of components on a printed circuit board before insertion of components, wherein the thickness delta of the lifting cushion strip is 0.2 to 1mm; inserting the components, andafter inserting the components, supporting the main body of the components on the elevating cushion strip; after the wave soldering, withdrawing the elevating cushion strip from the bottom of the component body. The elevating cushion strip is used for automatically lifting a component device, so that work efficiency of the components is improved; the elevating cushion strip can precisely control the elevation height, so that the method prevents the inconsistent and unreasonable elevation height on both sides of the component and solves the defects of pin deformation and stress concentration caused by the unreasonable elevation height. In addition, mounting the elevating cushion strip can eliminate the risk of veneer installation between the component and the printed circuit board with barecircuit on the surface during the insertion process and improve the service reliability of the printed circuit board.

Description

technical field [0001] The invention relates to a wave soldering method, in particular to an electronic assembly soldering method for automatically raising wave soldering of components. Background technique [0002] Wave soldering is a highly reliable electronic assembly welding method. Its principle is to use electric pumps, electromagnetic pumps or nitrogen injection to make high-temperature molten liquid solder jets form solder waves, allowing components to be inserted into printed boards Direct contact with high-temperature molten liquid solder, through the solder wave peak, to achieve the purpose of soldering. Component elevation is an installation technical requirement for printed board assembly in the electronic assembly process. If the components are installed on the exposed circuit, there should be at least 0.25mm and a maximum of 0.25 mm between the bottom of the component body and the exposed circuit. No more than 1.0mm spacing. [0003] The wave soldering proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34B23K1/20
CPCB23K1/20H05K3/34
Inventor 刘双宝江琛徐燕铭贺晓斌苏宪法翁海红王志国
Owner SHANGHAI AEROSPACE EQUIP MFG GENERAL FACTORY
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