A heat dissipation structure of a high-power chip of an automobile audio entertainment system host

Abstract

The invention relates to a high-power chip heat dissipation structure of an automobile audio entertainment system host, Including top shell, extruded aluminum fin, heat sink cover plate, heat dissipate silica gel pad, a PCB board and a middle frame for mounting a high-power chip, Top shell, extruded aluminum fin, A PCB board is fixedly installed on the middle frame from top to bottom in turn, Thetop shell covers the top of the extruded aluminum fin, the cover plate covers the front and back sides of the extruded aluminum fin, the heat dissipation silica gel pad is arranged between the extruded aluminum fin and the high-power chip, the heat dissipation silica gel pad is pasted on the high-power chip, and the heat dissipation silica gel pad is extruded and fixed by the bottom of the extruded aluminum fin. The aluminum-extruded fin comprises a stepped mounting frame and a plurality of heat dissipation trapezoidal teeth, which are manufactured by an aluminum-extruding process, wherein thestepped mounting frame and the heat dissipation trapezoidal teeth are formed by an aluminum extrusion process. The whole structure design of the heat dissipation structure is ingenious, and the heatdissipation area is greatly increased through the special structure of the aluminum-extruded heat dissipation fin combined with the heat dissipation fin cover plate and the heat dissipation silica gelpad, so that the rapid heat dissipation of the high-power chip can be realized.

Description

technical field [0001] The invention relates to the technical field of car audio entertainment systems, in particular to a high-power chip heat dissipation structure of a car audio entertainment system host. Background technique [0002] With the development of my country's economy, cars have become an indispensable part of people's lives. With the rapid growth of the number of cars in recent years, people's requirements for various functions of cars are also getting higher and higher. A very practical and convenient tool that has gained widespread attention. At present, the car audio entertainment system puts forward many requirements in terms of functions, such as dual antennas and dual CPUs, which requires more functions for the host chip of the audio entertainment system, and the heat dissipation process of the host is generally cast aluminum process and aluminum plate copper Stamping. Among them, cast aluminum can process complex structures, but has a small thermal con...

AI Technical Summary

Problems solved by technology

Among them, cast aluminum can process complex structures, but has a small thermal conductivity and poor heat dissipation performance, while copper and aluminum plates cannot stamp complex shapes. These two heat dissipation structures can only meet the heat dissipation of low-power chips, and cannot meet the current high-power requirements. Chip cooling

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