A composite buffer layer epitaxial structure for improving LED production efficiency
A technology of composite buffer layer and epitaxial structure, applied in electrical components, circuits, semiconductor devices, etc., can solve the problem of insufficient crystal quality of GaN materials, and achieve the effects of reducing production costs, improving production efficiency, and improving luminous efficiency.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0029] In this embodiment, the sapphire pattern substrate is used as the growth substrate, and Al is first prepared on the sapphire pattern substrate by the atomic layer deposition method. 2 o 3 / AlN periodic structure that is the composite buffer layer, and then MOCVD method is used in the Al 2 o 3 / AlN periodic structure of the sapphire substrate prepared LED epitaxial structure. The specific preparation method is as follows:
[0030] (1) Firstly, Al was prepared on a sapphire pattern substrate by atomic layer deposition method. 2 o 3 / AlN periodic structure, preparation of Al 2 o 3 When layering, trimethylaluminum and water are used as reaction sources, the feeding time of trimethylaluminum, purge, water and re-purge are respectively 0.2s, 3s, 0.2s and 3s, the growth temperature is 300℃, the thickness 4.6nm; when preparing the AlN layer, trimethylaluminum and ammonia are used as the reaction source, and the feeding time of trimethylaluminum, purging, ammonia and re-p...
Embodiment 2
[0038] In this embodiment, the sapphire pattern substrate is used as the growth substrate, and Al is first prepared on the sapphire pattern substrate by the atomic layer deposition method. 2 o 3 / AlN periodic structure that is the composite buffer layer, and then MOCVD method is used in the Al 2 o 3 / AlN periodic structure of the sapphire substrate prepared LED epitaxial structure. The specific preparation method is as follows:
[0039] (1) Firstly, Al was prepared on a sapphire pattern substrate by atomic layer deposition method. 2 o 3 / AlN periodic structure, preparation of Al 2 o 3 When layering, use trimethylaluminum and water as the reaction source, the feeding time of trimethylaluminum, purge, water and re-purge are respectively 0.2s, 1s, 0.1s and 5s, the growth temperature is 350℃, the thickness 5nm; when preparing the AlN layer, trimethylaluminum and ammonia are used as the reaction source, and the feeding time of trimethylaluminum, purging, ammonia and re-purgi...
Embodiment 3
[0047] In this embodiment, the sapphire pattern substrate is used as the growth substrate, and Al is first prepared on the sapphire pattern substrate by the atomic layer deposition method. 2 o 3 / AlN periodic structure that is the composite buffer layer, and then MOCVD method is used in the Al 2 o 3 / AlN periodic structure of the sapphire substrate prepared LED epitaxial structure. The specific preparation method is as follows:
[0048] (1) Firstly, Al was prepared on a sapphire pattern substrate by atomic layer deposition method. 2 o 3 / AlN periodic structure, preparation of Al 2 o 3 When layering, trimethylaluminum and water are used as reaction sources, the feeding times of trimethylaluminum, purge, water and re-purge are respectively 0.5s, 10s, 0.5s and 1s, the growth temperature is 200℃, the thickness 5nm; when preparing the AlN layer, trimethylaluminum and ammonia are used as the reaction source, and the feeding time of trimethylaluminum, purging, ammonia and re-p...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 
