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Systems and methods for thermal management for high power density EMI shielded electronic devices

A device and shielding cover technology, applied in the field of systems and methods for thermal management of electronic devices for high power density EMI shielding, can solve problems such as signal interference

Active Publication Date: 2019-01-04
COMMSCOPE TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Both integrated antennas and digital components are susceptible to noise pickup that introduces interference to the signal processed by the component

Method used

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  • Systems and methods for thermal management for high power density EMI shielded electronic devices
  • Systems and methods for thermal management for high power density EMI shielded electronic devices
  • Systems and methods for thermal management for high power density EMI shielded electronic devices

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0034]Example 1 includes an electronic module comprising: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electromagnetic interference (EMI) shield mounted to the circuit board, wherein the at least one integrated circuit is mounted on the circuit board by within the perimeter defined by the EMI shielding grid; and a heat dissipation EMI shielding cover secured to the at least one EMI shielding grid, wherein the heat dissipation EMI shielding cover seals the at least one integrated circuit within the at least one EMI shielding grid; wherein the heat dissipation EMI shielding cover seals the at least one integrated circuit within the at least one EMI shielding grid; The EMI shielding cover includes a spring-loaded thermal interface in thermally conductive contact with the at least one integrated circuit.

example 2

[0035] Example 2 includes the module of Example 1, wherein the heat-dissipating EMI shielding cover includes an EMI-shielding cover member having a first surface engaged with the at least one EMI-shielding grid and an opposing second surface including a plurality of heat-dissipating fins.

example 3

[0036] Example 3 includes the module of Example 2, wherein the EMI shielding cover member includes one or more compression stop struts extending from the first surface, wherein the one or more compression stop struts have a calibration to limit compression of the spring loaded thermal interface length.

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PUM

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Abstract

Systems and methods for thermal management for high power density EMI shielded electronic devices. In one embodiment, an electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at leastone EMI shield fence; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface in conductive thermal contact with the at least one integrated circuit.

Description

[0001] Cross References to Related Applications [0002] This application claims priority and benefit to U.S. Provisional Patent Application 62 / 317,929, filed April 4, 2016, entitled "SYSTEMS AND METHODS FOR THERMALMANAGEMENT FOR HIGH POWER DENSITY EMI SHIELDED ELECTRONIC DEVICES," which is incorporated by reference in its entirety This article. Background technique [0003] Modern products that transmit and receive radio frequency (RF) signals often include digital components and one or more integrated antennas. Both integrated antennas and digital components are susceptible to noise pickup that introduces interference to the signal being processed by the component. Adding electromagnetic interference (EMI) shielding around these components is effective in mitigating this interference. However, especially in high-frequency RF communication applications, digital components are often implemented using integrated system-on-chip (SOC) devices. As technology continues to advanc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K7/20
CPCH01L23/3675H01L23/42H01L23/433H05K1/0203H05K1/0216H05K7/20409H05K7/20445H01L2924/14H01L2924/3025H01L23/053H01L23/4006H05K1/181H05K9/0032H05K2201/10098H05K2201/10371H01L2224/16227H01L2924/19105H01L2224/73253H01L2924/15311H01L2224/32245H01L24/32H01L24/16H01L24/73H01L21/4882H01L21/52H01L23/552H05K1/0218H01L2023/4031H01L2023/405H01L2023/4087H01L2924/1421H05K2201/10265H05K2201/10409H05K2201/10522H05K2201/10674H05K2201/10734H05K1/021
Inventor K·克雷格
Owner COMMSCOPE TECH LLC